×

Highly integrated chip-on-chip packaging

  • US 5,977,640 A
  • Filed: 06/26/1998
  • Issued: 11/02/1999
  • Est. Priority Date: 06/26/1998
  • Status: Expired due to Term
First Claim
Patent Images

1. An apparatus comprising:

  • a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other; and

    an interconnection substrate for electrically connecting said chips to external circuitry, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external circuitry, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements;

    wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chins, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×