Element interconnections for multiple aperture transducers
First Claim
1. A multiple aperture ultrasonic transducer including a linear array of transmitting and receiving elements wherein each element is comprised of a middle segment and at least one pair of outer segments, the middle segment and outer segments forming apertures of the array, and a connection assembly for interconnecting the outer segments of each element and for connecting the segments of each element to transmit/receive circuits, the connection assembly comprising:
- for each element of the array,an electrode layer located directly adjacent the segments of the element and havingan electrode area corresponding to each segment of the element, each electrode area being located adjacent to and connecting to the corresponding segment,an insulating layer superimposed on the electrode layer and havinga segment to segment connection opening corresponding to and located within the electrode area of each outer segment,a segment to segment connection area for and corresponding to each pair of outer segments forming an aperture, each segment to segment connection area extending between the segment to segment connection openings of the pair of outer segments,a middle segment connection opening corresponding to and located within the electrode area of the middle segment,a middle segment connection area extending from the middle segment connection opening and to an edge of the element, anda connection layer superimposed on the insulating area and havinga middle segment connector connected to the middle segment electrode and extending from the middle segment connection opening and across the middle segment connection area to a pad at the edge of the element to connect to a transmit/receive circuit, andfor each pair of outer segments forming an aperture,a segment to segment connector extending across the segment to segment connection area of the outer segments and connected to the electrode areas of the outer segments and to a pad at the edge of the element to connect to a transmit/receive circuit.
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Accused Products
Abstract
A multiple aperture ultrasonic transducer having a linear array of elements, each element having a plurality of segments forming apertures of the array, and a connection assembly for interconnecting the segments and connecting the segments to circuits. The connection assembly includes an electrode layer directly adjacent to the segments, at least one insulating layer, and at least one connector layer. The electrode layer has an electrode area for each segment and one of the insulating layers has a connection opening for each segment and connection areas for pairs of segments while the connection layer has segment to segment connectors and segment pad connectors. Each element may be divided into sub-elements with connection cross-overs offset by one sub-element along the array and alternately reversed while alternate middle segments connect to alternate sides. The connection assembly may include interlayer connector layer and may be constructed onto a carrier which may be removed before attachment to a backing body, or the connection assembly may be deposited onto the array before attachment to a backing body. The connection assembly may be fabricated as a single assembly with a monolithic block of piezoelectric material and the assembly diced to a predetermined depth and across a predetermined width so that selected connections between electrode areas and to the pads remain intact. Interlayer vias are staggered and have clearance openings extending into the dicing kerf to reduce space and to insure connection after dicing.
47 Citations
10 Claims
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1. A multiple aperture ultrasonic transducer including a linear array of transmitting and receiving elements wherein each element is comprised of a middle segment and at least one pair of outer segments, the middle segment and outer segments forming apertures of the array, and a connection assembly for interconnecting the outer segments of each element and for connecting the segments of each element to transmit/receive circuits, the connection assembly comprising:
for each element of the array, an electrode layer located directly adjacent the segments of the element and having an electrode area corresponding to each segment of the element, each electrode area being located adjacent to and connecting to the corresponding segment, an insulating layer superimposed on the electrode layer and having a segment to segment connection opening corresponding to and located within the electrode area of each outer segment, a segment to segment connection area for and corresponding to each pair of outer segments forming an aperture, each segment to segment connection area extending between the segment to segment connection openings of the pair of outer segments, a middle segment connection opening corresponding to and located within the electrode area of the middle segment, a middle segment connection area extending from the middle segment connection opening and to an edge of the element, and a connection layer superimposed on the insulating area and having a middle segment connector connected to the middle segment electrode and extending from the middle segment connection opening and across the middle segment connection area to a pad at the edge of the element to connect to a transmit/receive circuit, and for each pair of outer segments forming an aperture, a segment to segment connector extending across the segment to segment connection area of the outer segments and connected to the electrode areas of the outer segments and to a pad at the edge of the element to connect to a transmit/receive circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
Specification