Multiple field of view calibration plate for use in semiconductor manufacturing
First Claim
1. An article of manufacture both for coordinating multiple fields of view of a plurality of cameras so as to facilitate determining a distance between features of a semiconductor wafer, each feature disposed within a different field of view, and for correcting image distortion in each field of view, the article comprising:
- a substantially rigid dimensionally-stable substrate having a plurality of image distortion calibration targets,each of said image distortion calibration targets being for correcting image distortion within a field of view, and being disposed within a different field of view at a known relative position so as to facilitate determining the distance between features of a semiconductor wafer.
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Accused Products
Abstract
An article of manufacture is provided both for coordinating multiple fields of view of a plurality of cameras so as to facilitate determining the distance between features on a semiconductor wafer, each feature being disposed within a different field of view, and for correcting image distortion within each field of view. The article of the invention includes a substantially rigid dimensionally-stable substrate, such as a plate, having a plurality of image distortion calibration targets, that are each located at a known relative position. In semiconductor wafer applications, each calibration target is disposed on the substrate so the target is in the field of view of a camera positioned to include a portion of the edge of the semiconductor wafer at run-time. In a preferred embodiment, each calibration target is disposed at an orientation angle such that a first principle axis of the calibration target is perpendicular to a tangent to the perimeter of the semiconductor wafer. In semiconductor wafer applications, it is preferred that a surface of the substrate be of a size and shape such that each calibration target disposed on the substrate can be in the field of view of a camera positioned to include a portion of the edge of the semiconductor wafer at run-time. In a preferred embodiment, the substrate includes physical alignment features that facilitate coordination of the multi-camera coordinate system of the article of the invention with the coordinate system of a semiconductor manufacturing machine.
47 Citations
16 Claims
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1. An article of manufacture both for coordinating multiple fields of view of a plurality of cameras so as to facilitate determining a distance between features of a semiconductor wafer, each feature disposed within a different field of view, and for correcting image distortion in each field of view, the article comprising:
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a substantially rigid dimensionally-stable substrate having a plurality of image distortion calibration targets, each of said image distortion calibration targets being for correcting image distortion within a field of view, and being disposed within a different field of view at a known relative position so as to facilitate determining the distance between features of a semiconductor wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification