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Apparatus and method for dissipating heat from a core module assembly of a retail terminal

  • US 5,978,225 A
  • Filed: 04/30/1998
  • Issued: 11/02/1999
  • Est. Priority Date: 04/30/1998
  • Status: Expired due to Term
First Claim
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1. A core module assembly of a retail terminal, comprising:

  • a microprocessor which performs computing functions associated with operation of said retail terminal, whereby heat is generated by said microprocessor during performance of said computing functions;

    a first heat transfer structure positioned in thermal communication with said microprocessor, said first heat transfer structure having (i) a body portion, and (ii) a key portion extending from said body portion;

    a housing for containing said microprocessor and said first heat transfer structure therein, said housing including a second heat transfer structure having a keying slot defined therein, wherein (i) relative movement between said first heat transfer structure and said second heat transfer structure is limited when said key portion of said first heat transfer structure is positioned within said keying slot of said second heat transfer structure, and (ii) said second heat transfer structure defines an outer surface of said housing, whereby heat may be transferred from a first location within said housing to a second location outside of said housing via said first heat transfer structure and said second heat transfer structure; and

    a fastener for maintaining said key portion of said first heat transfer structure within said keying slot of said second heat transfer structure.

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