System for depositing a material on a substrate using light energy

• US 5,980,637 A
• Filed: 12/20/1996
• Issued: 11/09/1999
• Est. Priority Date: 12/20/1996
• Status: Expired due to Fees

• Current Assignee: STEAG RTP Systems, Inc. (KSBG Kommunale Beteiligungsgesellschaft GmbH & Company KG)
• Original Assignee: STEAG RTP Systems, Inc. (KSBG Kommunale Beteiligungsgesellschaft GmbH & Company KG)
• Inventors: Sharangpani, Rahul, Singh, Rajendra
• Primary Examiner(s): Chin, Peter
• Assistant Examiner(s): COLAIANNI, MICHAEL
• Application Number:
  US08/771,058
• Time in Patent Office: 1,054 Days
• Field of Search: 118/300, 118/620, 118/641, 118/642, 118/666, 118/667, 118/712, 427/457, 427/487, 427/490, 427/492, 427/493, 427/508, 427/521, 427/532, 427/541, 427/542, 427/545, 427/546, 427/553, 427/557, 427/558, 427/559, 427/581, 427/595, 427/597
• US Class Current: 118/641
• CPC Class Codes: B05D 3/061 using U.V.
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67115 mainly by radiation

Abstract

The present invention is generally directed to a process and a system for transforming a liquid into a solid material using light energy. In particular, a solution containing a parent material in a liquid form is atomized in a reaction vessel and directed towards a substrate. The atomized liquid is exposed to light energy which causes the parent material to form a solid coating on a substrate. The light energy can be provided from one or more lamps and preferably includes ultraviolet light. Although the process of the present invention is well suited for use in many different and various applications, one exemplary application is in depositing a dielectric material on a substrate to be used in the manufacture of integrated circuit chips.

Claims

1. A system for forming an electrical insulating layer in an integrated circuit comprising:

at least one nozzle for atomizing a liquid containing an electrical insulating material and a solvent into liquid droplets;

a reactor vessel in fluid communication with said at least one nozzle for receiving said liquid droplets, said reactor vessel being adapted to contain a substrate comprising a semiconductive material towards which said liquid droplets are directed; and

at least one incoherent lamp for providing light energy to said reactor vessel, said at least one lamp being configured to emit vacuum ultraviolet light, said at least one incoherent lamp being positioned so as to directly contact said liquid droplets with vacuum ultraviolet light prior to said droplets being deposited onto a substrate within said reactor vessel, said at least one lamp being spaced a predetermined distance from said liquid droplets being emitted from said nozzle and providing light energy in an amount sufficient to vaporize said solvent contained within said liquid droplets as said droplets are being deposited onto said substrate in order to form a solid material on said substrate.

2. A system as defined in claim 1, wherein said at least one lamp is configured to also emit thermal light energy.

3. A system as defined in claim 1, further comprising a gas reservoir in communication with said at least one nozzle, said gas reservoir being adapted to contain a pressurized gas for atomizing said electrical insulating material.

4. A system as defined in claim 1, further comprising a liquid reservoir for containing said electrical insulating material and a flow control device for controlling the flow of said electrical insulating material from said liquid reservoir, said liquid reservoir being in fluid communication with said at least one nozzle.

5. A system as defined in claim 4, further comprising:

a temperature sensing device for sensing the temperature within said reactor vessel; and

a controller in electrical communication with said temperature sensing device, said flow control device, and said at least one lamp, said controller being configured to receive temperature information from said temperature sensing device and, based on said information, to control the flow of said electrical insulating material from said liquid reservoir and to control the amount of light energy being emitted from said at least one lamp for forming a solid material within said reactor vessel.

6. A system as defined in claim 5, wherein said controller comprises a microprocessor.

7. A system as defined in claim 1, wherein said system includes at least a first incoherent lamp and a second incoherent lamp, said first incoherent lamp primarily emitting thermal energy while said second incoherent lamp primarily emitting optical energy including said vacuum ultraviolet light.

8. A system as defined in claim 1, wherein said at least one nozzle is configured to be positioned above a substrate contained within said reactor vessel.

9. A system as defined in claim 1, further comprising means for maintaining a vacuum within said reactor vessel.

10. A system as defined in claim 1, wherein said at least one incoherent lamp only emits vacuum ultraviolet light.

11. A system as defined in claim 7, wherein said first incoherent lamp is positioned primarily to heat a substrate contained within said reactor vessel.

12. A system for forming an electrical insulating layer in an integrated circuit comprising:

a liquid reservoir for containing a liquid comprising an electrical insulating material and a solvent;

a nozzle in fluid communication with said liquid reservoir for atomizing said liquid containing said electrical insulating material into liquid droplets;

a reactor vessel in fluid communication with said nozzle for receiving said liquid droplets, said reactor vessel being adapted to contain a substrate comprising a semiconductive material towards which said liquid droplets are directed;

a first incoherent lamp and a second incoherent lamp for providing light energy to said reactor vessel, said first incoherent lamp being configured to emit ultraviolet light, said second incoherent lamp being configured to emit thermal energy, said first incoherent lamp being positioned so as to directly contact said liquid droplets with ultraviolet light prior to said droplets being deposited onto a substrate contained within said reactor vessel, said lamps providing light energy to said reactor vessel in an amount sufficient to vaporize said solvent contained in said liquid droplets in order to form a solid coating made from said electrical insulating material on said substrate contained in said reactor vessel;

a flow control device for regulating the flow of said liquid from said liquid reservoir to said nozzle; and

a controller configured to control said flow control device for controlling the flow of said liquid from said liquid reservoir to said nozzle.

13. A system as defined in claim 12, wherein said controller is in electrical communication with said lamps for controlling the amount of light energy being emitted by said lamps in relation to the amount of said liquid entering said reactor vessel.

14. A system as defined in claim 13, further comprising a temperature sensing device for sensing the temperature within said reactor vessel, said temperature sensing device being in electrical communication with said controller, wherein said controller is configured to control the flow of said liquid from said liquid reservoir to said nozzle based upon temperature information received from said temperature sensing device.

15. A process as defined in claim 14, wherein said controller comprises a microprocessor.

16. A system as defined in claim 12, wherein said nozzle is configured to atomize said liquid into liquid droplets having a diameter of less than about 20 microns.

17. A system as defined in claim 12, wherein said nozzle is configured to be positioned above a substrate contained within said reactor vessel.

18. A system as defined in claim 12, further comprising means for maintaining a vacuum within said reactor vessel.

19. A system for forming an electrical insulating layer in an integrated circuit comprising:

at least one nozzle for atomizing a liquid comprising an electrical insulating material and a solvent into liquid droplets;

a reactor vessel in fluid communication with said at least one nozzle for receiving said liquid droplets;

a substrate holder contained within said reactor vessel, said substrate holder being configured to hold a substrate comprising a semiconductive material, said substrate holder being spaced a determined distance from said nozzle and being positioned such that said liquid containing said electrical insulating material emitted from said nozzle is deposited onto a substrate held on said substrate holder; and

a first incoherent lamp and a second incoherent lamp, said first incoherent lamp being configured to emit optical energy, said second incoherent lamp being configured to emit thermal energy, said first incoherent lamp being positioned so as to directly contact said liquid droplets with optical energy prior to said droplets being deposited onto a substrate held on said substrate holder, said lamps providing light energy to said reactor vessel in an amount sufficient to vaporize said solvent contained in said liquid droplets in order to form a solid coating made from said electrical insulating material on said substrate contained in said reactor vessel.

20. A system as defined in claim 19, wherein said first said incoherent lamp emits ultraviolet radiation.

21. A system as defined in claim 19, wherein said first incoherent lamp emits vacuum ultraviolet radiation.

22. A system as defined in claim 20, wherein said second incoherent lamp is configured to emit light at a wavelength of greater than about 0.4 microns.

23. A system for forming an electrical insulating layer in an integrated circuit comprising:

at least one nozzle for atomizing a liquid comprising an electrical insulating material and a solvent into liquid droplets;

a reactor vessel in fluid communication with said at least one nozzle for receiving said liquid droplets;

a substrate holder contained within said reactor vessel, said substrate holder being configured to hold a substrate comprising a semiconductive material, said substrate holder being spaced a determined distance from said nozzle and being positioned such that said electrical insulating material emitted from said nozzle is deposited onto a substrate held on said substrate holder;

a heat source for heating a substrate held on said substrate holder while said electrical insulating material is deposited onto said substrate; and

a first incoherent lamp being configured to emit optical energy, said first incoherent lamp being positioned so as to directly contact said liquid droplets with optical energy prior to said droplets being deposited onto said substrate held on said substrate holder, said first incoherent lamp and said heat source supplying light energy and heat energy in an amount sufficient to vaporize said solvent contained in said liquid droplets and form a solid coating on said substrate made from said electrical insulating material.

24. A system as defined in claim 23, wherein said heat source comprises a second incoherent lamp, said second incoherent lamp being configured to emit thermal energy.

25. A system as defined in claim 23, wherein said first incoherent lamp emits ultraviolet radiation.

26. A system as defined in claim 24, wherein said second incoherent lamp is configured to emit light at a wavelength of greater than about 0.4 microns.

27. A system as defined in claim 23, further comprising a controller in electrical communication with said first incoherent lamp, said controller being configured to control the amount of light energy being emitted by said first incoherent lamp in relation to the amount of said liquid entering said reactor vessel.

28. A system as defined in claim 23, wherein said at least one nozzle is positioned above said substrate holder.