Bonding machine

• US 5,980,663 A
• Filed: 02/27/1998
• Issued: 11/09/1999
• Est. Priority Date: 05/15/1995
• Status: Expired due to Term

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Shellcase Ltd. (Adeia Inc.)
• Inventors: Badehi, Pierre
• Primary Examiner(s): SELLS, JAMES D
• Application Number:
  US08/952,019
• Time in Patent Office: 620 Days
• Field of Search: 156/73.5, 156/499, 156/580, 156/583.1, 156/64, 156/358, 156/359
• US Class Current: 156/64
• CPC Class Codes: B29C 65/483 Reactive adhesives, e.g. chemically curing adhesives
• CPC Class Codes: B29C 65/485 Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
• CPC Class Codes: B29C 65/521 by spin coating
• CPC Class Codes: B29C 65/7847 using vacuum to hold at least one of the parts to be joined vacuum work holders in general B25B11/005
• CPC Class Codes: B29C 66/1122 Single lap to lap joints, i.e. overlap joints B29C66/45, B29C66/472, B29C66/52272 take precedence
• CPC Class Codes: B29C 66/452 the article having a disc form, e.g. making CDs or DVDs
• CPC Class Codes: B29C 66/8242 Pneumatic or hydraulic drives using fluid pressure directly acting on the parts to be joined B29C66/8266
• CPC Class Codes: B29C 66/8322 Joining or pressing tools reciprocating along one axis
• CPC Class Codes: B29C 66/91212 involving measurement means being part of the welding jaws, e.g. integrated in the welding jaws
• CPC Class Codes: B29C 66/91213 and measuring the electrical resistance of a resistive element belonging to said welding jaws, said element being, e.g. a thermistor
• CPC Class Codes: B29C 66/91231 of the joining tool
• CPC Class Codes: B29C 66/91421 of the joining tools
• CPC Class Codes: B29C 66/91431 the temperature being kept constant over time
• CPC Class Codes: B29C 66/9241 by controlling or regulating the pressure, the force or the mechanical power
• CPC Class Codes: B29C 66/929 characterized by specific pressure, force, mechanical power or displacement values or ranges
• CPC Class Codes: B29C 66/961 involving a feedback loop mechanism, e.g. comparison with a desired value
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Abstract

This invention discloses a method of bonding a lower substrate with an upper substrate comprising applying an adhesive (56) on at least one of the lower (12) and the upper (14) substrates, and rotating the lower and the upper substrates thereby to create a centrifugal force which causes the adhesive to spread between the lower and the upper substrates with a substantially uniform thickness, while applying a pressure upon the upper substrate thereby to bond the lower and upper substrates. The invention also discloses an apparatus for bonding the lower substrate with the upper substrate.

Claims

1. A method of bonding a lower substrate with an upper substrate comprising the steps of:

applying an adhesive on at least one of said lower and said upper substrates;

placing said upper substrate upon said lower substrate, with said adhesive therebetween;

heating at least one of said lower and said upper substrates;

controlling the temperature of at least one of said lower and said upper substrates; and

rotating said lower and said upper substrates thereby to create a centrifugal force which causes said adhesive to spread between said lower and said upper substrates with a substantially uniform thickness, while applying a pressure upon said upper substrate thereby to bond said lower and said upper substrates.

2. A method according to claim 1 further comprising the step of controlling application of said pressure.

3. A bonding machine comprising:

a lower chuck adapted to fixedly receive a lower substrate;

an upper chuck rotatably engageable with said lower chuck and operative to apply a pressure upon an upper substrate when positioned upon said lower substrate; and

a rotator operative to rotate said lower chuck, thereby to create a centrifugal force which causes an adhesive applied on at least one of said lower and said upper substrates to spread therebetween with a substantially uniform thickness, wherein application of said pressure by said upper chuck upon said upper substrate causes bonding of said lower and said upper substrates;

wherein at least one of said lower and said upper chucks comprises a heater, and wherein at least one of said lower and said upper chucks comprises a temperature sensor which communicates with a controller for controlling the temperature of at least one of said lower and said upper chucks.

4. A bonding machine according to claim 3 wherein said lower chuck comprises at least one engagement element and said upper chuck comprises at least one engagement arm for selectable engagement with said at least one engagement element.

5. A bonding machine according to claim 4 further comprising an orientation sensor operative to sense a position of said at least one engagement arm and to signal said rotator to rotate said lower chuck to a position such that said at least one engagement element is aligned with said at least one engagement arm so that said at least one engagement element and said at least one engagement arm may engage one another.

6. A bonding machine according to claim 3 wherein said rotator is a variable speed servomotor.

7. A bonding machine according to claim 3 further comprising a motion device for selectably moving said upper chuck generally vertically with respect to said lower chuck.