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Near chip size integrated circuit package

  • US 5,981,314 A
  • Filed: 10/31/1996
  • Issued: 11/09/1999
  • Est. Priority Date: 10/31/1996
  • Status: Expired due to Term
First Claim
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1. A method of forming a plurality of integrated circuit chip packages from an insulating substrate, said method comprising the steps of:

  • providing said insulating substrate which has sections, said sections having first metallizations formed on a first surface of said insulating substrate;

    mounting an integrated circuit chip in each of said sections, said integrated circuit chips having first surfaces with bonding pads formed thereon;

    electrically connecting said bonding pads to corresponding ones of said first metallizations with bond wires;

    forming a dam on said first surface of said insulating substrate around a perimeter of said insulating substrate;

    encapsulating said bonding pads, said first surfaces of said integrated circuit chips, said first metallizations and said first surface of said insulating substrate with a layer of encapsulant by filling a pocket defined by said dam with an electrically insulating encapsulant; and

    cutting said layer of encapsulant and said insulating substrate along a periphery of each of said sections to form said plurality of integrated circuit chip packages.

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