Video modulator arrangement

• US 5,982,446 A
• Filed: 10/15/1996
• Issued: 11/09/1999
• Est. Priority Date: 10/18/1995
• Status: Expired due to Term

• Current Assignee: Mitel Semiconductor, Limited (Microchip Technology Incorporated)
• Original Assignee: Zarlink Semiconductor Limited (Microchip Technology Incorporated)
• Inventors: Millard, Stuart J
• Primary Examiner(s): Peng, John K.
• Assistant Examiner(s): CHU, DINH C P
• Application Number:
  US08/730,375
• Time in Patent Office: 1,120 Days
• Field of Search: 348/470, 348/484, 348/486, 348/724, 348/462, 348/482-485, 348/738, 348/723, 348/728, 332/151, 455/108
• US Class Current: 348/484
• CPC Class Codes: H04B 14/08 characterised by the use of a sub-carrier
• CPC Class Codes: H04N 7/04 Systems for the transmission of one television signal, i.e. both picture and sound, by a single carrier H04N7/084, H04N7/087 take precedence

Abstract

In a single-chip multistandard video modulator arrangement in which audio signals for transmission with video signals are first modulated onto a subcarrier and then combined with the video signals for modulation onto a VHF or UHF main carrier, the modulated subcarrier signals are passed through a high-pass filter before being combined with the video signals in order to reduce the amplitude of any audio frequency components, and the resulting variations in main carrier amplitude, which tend to produce "sound in vision" effects.

Claims

1. A video modulator arrangement comprising:

a single-ended to differential amplifier in which audio frequency signals are amplified;

a first modulator circuit in which the amplified audio frequency signals are amplitude-modulated onto a sub-carrier signal;

a combining circuit arrangement in which output signals from said first modulator circuit are combined with video signals;

a second modulator circuit in which signals from said combining circuit arrangement are modulated onto a high frequency carrier signal; and

high pass filter means connected between an output of the first modulator circuit and the combining circuit arrangement.

2. The modulator arrangement in accordance with claim 1, wherein the first modulator circuit is arranged to modulate the audio frequency signals onto the sub-carrier signal selectively as amplitude modulation or as frequency modulation.

3. The modulator arrangement in accordance with claim 1, wherein the first modulator circuit comprises a balanced mixer circuit.

4. The modulator arrangement in accordance with claim 2, wherein the first modulator circuit comprises a balanced mixer circuit.

5. The modulator arrangement in accordance with claim 1, wherein the high pass filter means is a first order balanced filter.

6. The modulator arrangement in accordance with claim 2, wherein the high pass filter means is a first order balanced filter.

7. The modulator arrangement in accordance with claim 3, wherein the high pass filter means is a first order balanced filter.

8. The modulator arrangement in accordance with claim 4, wherein the high pass filter means is a first order balanced filter.

9. The modulator arrangement in accordance with claim 5, wherein the filter incorporates a balanced transconductance amplifier interposed between the first modulator circuit and the combining circuit arrangement.

10. The modulator arrangement in accordance with claim 6, wherein the filter incorporates a balanced transconductance amplifier interposed between the first modulator circuit and the combining circuit arrangement.

11. The modulator arrangement in accordance with claim 7, wherein the filter incorporates a balanced transconductance amplifier interposed between the first modulator circuit and the combining circuit arrangement.

12. The modulator arrangement in accordance with claim 8, wherein the filter incorporates a balanced transconductance amplifier interposed between the first modulator circuit and the combining circuit arrangement.

13. The modulator arrangement in accordance with claim 2 implemented as a single-chip multi-standard video modulator.

14. The modulator arrangement in accordance with claim 4 implemented as a single-chip multi-standard video modulator.

15. The modulator arrangement in accordance with claim 6 implemented as a single-chip multi-standard video modulator.

16. The modulator arrangement in accordance with claim 8 implemented as a single-chip multi-standard video modulator.

17. The modulator arrangement in accordance with claim 10 implemented as a single-chip multi-standard video modulator.

18. The modulator arrangement in accordance with claim 12 implemented as a single-chip multi-standard video modulator.