Method and apparatus for identifying integrated circuits

• US 5,984,190 A
• Filed: 05/15/1997
• Issued: 11/16/1999
• Est. Priority Date: 05/15/1997
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Nevill, Leland R.
• Primary Examiner(s): Hajec, Donald
• Assistant Examiner(s): St. Cyr, Daniel
• Application Number:
  US08/857,100
• Time in Patent Office: 915 Days
• Field of Search: 235/492, 235/493, 235/494, 235/487, 438/10, 438/18
• US Class Current: 235/492
• CPC Class Codes: H01L 2223/54413 comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/5448 Located on chip prior to dicing and remaining on chip after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated circuit and method for identifying same is described. The integrated circuit includes a programmable identification circuit for storing electronic identification information. The integrated circuit also includes an optical identification mark displaying a machine-readable optical identification code which corresponds with the electronic identification information stored in the identification circuit. The data encoded in the optical identification code may be identical with that of the electronic identification information. Alternatively, a look-up table or other correlating means may be employed to associate the optical identification code with the electronic identification information. The integrated circuit is packaged in a housing, and another optical identification mark is placed on an external surface of the housing. This second optical identification mark displays a machine-readable optical identification code which is identical or correlated to the electronic identification information stored in the identification circuit and/or the optical identification code displayed by the optical identification mark on the integrated circuit. Consequently, convenient and traceable identification of individual integrated circuits is provided during and after manufacture.

Claims

1. A method of identifying a plurality of substantially identical integrated circuits formed on a common substrate, comprising the steps of:

programming each of the integrated circuits with respective electronic identification information distinguishing the integrated circuits from one another; and

marking each of the integrated circuits with respective optical identification code which corresponds with the respective electronic identification information;

reading the optical identification code on each of the integrated circuits; and

accessing a lookup table to associate the optical identification code on each of the integrated circuits with the corresponding electronic identification information.

2. The method of claim 1 wherein the step of programming each of the integrated circuits with electronic identification information includes the step of programming one of a plurality of programmable links.

3. The method of claim 1 wherein the step of marking each of the integrated circuits with optical identification code includes the step of placing an adhesive label on each of the integrated circuits.

4. The method of claim 1 wherein the step of marking each of the integrated circuits with optical identification code includes the step of inscribing a symbol on each of the integrated circuits.

5. The method of claim 1 wherein the step of marking each of the integrated circuits includes the step of marking respective portions of the substrate on which the integrated circuits are formed.

6. In a plurality of substantially identical integrated circuits formed on a common substrate, each of the integrated circuits including a programmable circuit for storing respective electronically readable identification code which distinguishes the integrated circuits from one another, a method of identifying the integrated circuits, comprising the steps of:

marking each of the integrated circuits with respective optical identification code;

accessing a lookup table to associate the optical identification code on each of the integrated circuits with the respective electronically readable identification code and

reading the optical identification code on each of the integrated circuits.

7. The method of claim 6 wherein the step of associating the optical identification code on each of the integrated circuits with the respective electronically readable identification code includes the steps of:

reading the electronically readable identification code stored in each of the integrated circuits;

reading the optical identification code marked on each of the integrated circuits; and

correlating the read electronically readable identification code with the read optical identification code for each of the integrated circuits.

8. The method of claim 6 wherein the step of associating the optical identification code on each of the integrated circuits with the respective electronically readable identification code includes the step of encoding identical data in the optical and electronically readable identification codes.

9. The method of claim 6 wherein the step of marking each of the integrated circuits includes the step of marking respective portions of the substrate on which the integrated circuits are formed.

10. A wafer comprising a plurality of dies, each die including an integrated circuit having a programmable identification circuit that stores identification data, and each die having an optical identification mark positioned thereon and encoding information corresponding to the identification data, optical identification mark on each die being accessed through a lookup table to correspond to the electronic identification information.

11. The wafer of claim 10 wherein the programmable identification circuit includes a plurality of programmable links.

12. The wafer of claim 10 wherein the optical identification mark encodes information identical to the identification data.

13. The wafer of claim 10 wherein the identification data uniquely distinguishes each of the dies.

14. A plurality of integrated circuit chips, each comprising:

a housing;

an integrated circuit enclosed within the housing and including an identification circuit that stores identification data distinguishing each of the integrated circuit chips from one another; and

an optical mark positioned on an exterior surface of the housing and encoding identification information being accessed through a lookup table to correspond to the identification data.

15. The integrated circuit chips of claim 14, further comprising electrical contacts connected to said housing and adapted to provide electrical connection between the integrated circuit and circuitry external to the housing.

16. The integrated circuit chips of claim 14 wherein the optical mark is a first optical mark encoding first identification information, and further comprising a second optical mark positioned on the integrated circuit enclosed within the housing and encoding second identification information corresponding to the identification data.

17. The integrated circuit chips of claim 16 wherein the first identification information is identical to the second identification information.

18. The integrated circuit chips of claim 14 wherein the identification information is the same as the identification data.

19. A method of identifying a plurality of substantially identical integrated circuits formed on a common substrate, each of the integrated circuits being formed on a respective one of a plurality of substrate dies, the method comprising:

programming each of the plurality of integrated circuits with respective electronic identification information for each of the integrated circuits; and

marking each of the dies with optical identification code which corresponds with the respective electronic identification information;

reading the optical identification code on each of the integrated circuits;

reading the electronic identification information from each of the integrated circuits; and

accessing a lookup table to associate the optical identification code on each of the integrated circuits with the corresponding electronic identification information.

20. The method of claim 19 wherein the electronic identification information is distinct for each of the integrated circuits.

21. The method of claim 19 wherein the optical identification code is distinct for each of the dies.

22. The method of claim 19 wherein the optical identification code and the electronic identification information include identical data.