Method for forming a filter
First Claim
1. A method for forming a filter with bulk support, comprising the steps of:
- a. providing a bulk substrate, said bulk substrate being etchable using a first predetermined etching process;
b. forming a thin film etch-stop over a first area of a first surface of said bulk substrate, said etch-stop being etchable using a second predetermined etching process and said etch-stop not being etchable using said first predetermined etching process;
c. forming at least part of a filter structure over a second area of said first surface, said second area including at least a portion of said first area and said filter structure not being etchable by said second predetermined etching process, said etch-stop positioned between said filter structure and said bulk substrate, and said filter structure including a plurality of pores filled by a material etchable by said second predetermined etching process;
d. etching a portion of said bulk substrate underneath said etch-stop using said first predetermined etching process beginning at a second surface of said bulk substrate to expose an underside of said etch-stop; and
e. etching at least a portion of said etch-stop and said material in said pores using said second predetermined etching process.
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Accused Products
Abstract
Surface micromachining and bulk micromachining are employed for realizing a porous membrane with bulk support for a microparticle filter. The filter is manufactured by a process employing a thin film etch-stop, in which the bulk substrate is etched using a first etching process followed by etching of the etch stop and of material within pores of a filter layer using a second etching process. The filter is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. The disclosed fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the filter surface, as may be desired for several purposes, such as fluid characterization, filter self-cleaning, or charging of the filter surfaces. Methods are shown for the realization of biological containment capsules based on this microfilter.
118 Citations
9 Claims
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1. A method for forming a filter with bulk support, comprising the steps of:
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a. providing a bulk substrate, said bulk substrate being etchable using a first predetermined etching process; b. forming a thin film etch-stop over a first area of a first surface of said bulk substrate, said etch-stop being etchable using a second predetermined etching process and said etch-stop not being etchable using said first predetermined etching process; c. forming at least part of a filter structure over a second area of said first surface, said second area including at least a portion of said first area and said filter structure not being etchable by said second predetermined etching process, said etch-stop positioned between said filter structure and said bulk substrate, and said filter structure including a plurality of pores filled by a material etchable by said second predetermined etching process; d. etching a portion of said bulk substrate underneath said etch-stop using said first predetermined etching process beginning at a second surface of said bulk substrate to expose an underside of said etch-stop; and e. etching at least a portion of said etch-stop and said material in said pores using said second predetermined etching process. - View Dependent Claims (2, 3, 4, 5)
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6. A method for forming a filter with bulk support, comprising the steps of:
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a. providing a bulk substrate etchable using a first predetermined etching process; b. forming at least part of a filter structure over an area of a first surface of said bulk substrate, including i) forming a plurality of pores in said filter structure, said pores filled with a material etchable by a second predetermined etching process, ii) forming at said first surface a layer unetchable using said first predetermined etching process; c. etching a portion of said bulk substrate underneath said area of said first surface using said first predetermined etching process beginning at a second surface of said bulk substrate to expose an underside of said layer; and d. etching at least a portion of said layer and said material filling said pores using said second predetermined etching process. - View Dependent Claims (7, 8, 9)
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Specification