Method of manufacturing microstructures and also microstructure

• US 5,985,412 A
• Filed: 11/20/1997
• Issued: 11/16/1999
• Est. Priority Date: 11/25/1996
• Status: Expired due to Fees

• Current Assignee: Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften e.V. (Max-Planck-Gesellschaft zur Frderung der Wissenschaften e)
• Original Assignee: Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften e.V. (Max-Planck-Gesellschaft zur Frderung der Wissenschaften e)
• Inventors: Gosele, Ulrich
• Primary Examiner(s): LONEY, DONALD J
• Application Number:
  US08/974,897
• Time in Patent Office: 726 Days
• Field of Search: 428/188, 428/178, 428/137, 428/172, 428/213, 428/428, 428/446, 437/245, 437/225, 437/241, 437/901, 437/974, 156/281, 156/290, 156/306.3, 228/116, 148/DIG. 12, 148/DIG. 135
• US Class Current: 428/172
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/187 by direct bonding
• CPC Class Codes: Y10S 438/906 Cleaning of wafer as interim step
• CPC Class Codes: Y10S 438/974 Substrate surface preparation
• CPC Class Codes: Y10T 428/24612 Composite web or sheet
• CPC Class Codes: Y10T 428/24661 Forming, or cooperating to form cells

Abstract

A method of manufacturing microstructures in which a hollow cavity is formed in a first wafer, in particular, a silicon wafer, and the hollow cavity is, covered over by a second wafer, which is in particular, also a silicon wafer, by a wafer bonding process in vacuum for the formation of an enclosed hollow cavity, wherein the wafer bonding is carried out in an ultra-high vacuum in order to achieve the smallest possible internal pressure in the hollow cavity of less than 0.1 mbar. The surfaces of the wafers which are to be brought into contact with one another are treated by a surface cleaning process in order to produce at least substantially pure surfaces, i.e. surfaces which consist substantially only of the material of the respective wafer and which are at least substantially free of H₂ O, H₂ and O₂. A microstructure is also claimed.

Claims

1. A microstructure, comprising at least a first and a second wafer which are bonded together, wherein at least one hollow cavity is present in at least one of the wafers and is covered over by the other wafer for formation of a closed hollow cavity

wherein an inner pressure of less that 0.1 mbar prevails in the hollow cavity, and

wherein surfaces of the wafers that are bonded together are substantially clean surfaces that consist essentially only of the material of the respective wafer and are substantially free of H₂ O, H₂ and O₂.

2. A microstructure in accordance with claim 1 wherein the first and second wafers are silicon wafers.

3. A microstructure in accordance with claim 1 wherein an inner pressure of less than 0.01 mbar prevails in the hollow cavity.

4. A method of manufacturing microstructures in which a hollow cavity is formed in a silicon wafer and is covered with a second wafer by a wafer bonding process in vacuum to form an enclosed hollow cavity, wherein surfaces of the wafers that are to be brought into contact with one another are treated by a surface cleaning process in order to produce substantially clean surfaces that consist essentially only of the material of the respective wafer and that are substantially free of H₂ O, H₂ and O₂, and wherein the wafer bonding is carried out in ultra-high vacuum for the purpose of achieving the smallest possible inner pressure in the hollow cavity of less than 0.1 mbar.

5. A method of manufacturing microstructures in accordance with claim 4 wherein the second wafer is a silicon wafer.

6. A method of manufacturing microstructures in which a hollow cavity is formed in a first wafer that is covered with a second wafer by a wafer bonding process in vacuum to form an enclosed hollow cavity,

wherein surfaces of the wafers that are to be brought into contact with one another are treated by a surface cleaning process in order to produce substantially clean surfaces that consist essentially only of the material of the respective wafer and that are substantially free of H₂ O, H₂ and O₂, and

wherein the wafer bonding is carried out in ultra-high vacuum for the purpose of achieving the smallest possible inner pressure in the hollow cavity of less than 0.1 mbar.

7. A method in accordance with claim 6, wherein the wafer bonding is carried out in the ultra-high vacuum at room temperature, or at a lower temperature with a subsequent thermal treatment (annealing step) either not being carried out or only being carried out at temperatures less that 200°

C.

8. A method in accordance with claim 6, wherein the surface cleaning of the surfaces of the wafers which are to be brought into contact with one another is carried out in a vacuum chamber prior to carrying out the bonding, both for hydrophobic wafers and also for hydrophilic wafers, by a thermal treatment at a suitable temperature in order to free the wafer surfaces of H₂ O, H₂ and O₂, with the thermal treatment of the hydrophobic wafers bringing about the desorption of the hydrogen and, with hydrophilic wafers, the vaporization of the absorbed water and the dissociation of the natural SiO₂ and the vaporization of the SiO which arises.

9. A method in accordance with claim 8 wherein the thermal treatment is carried out at a temperature in the range from 600°

C. to 800°

C.

10. A method in accordance with claim 6, wherein the surface cleaning of the surfaces of the wafers which are to be brought into contact with one another takes place in a vacuum chamber prior to carrying out the bonding by sputtering or by a plasma treatment with inert gases.

11. A method in accordance with claim. 6, wherein the wafers which are cleaned in a vacuum chamber are either bonded to one another in the same vacuum chamber or after transfer into a further vacuum chamber without the cleaned wafers being exposed in the intervening period to a reactive atmosphere, with the wafers not being exposed in the intervening period to any significantly elevated environmental pressure.