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Method of manufacturing microstructures and also microstructure

  • US 5,985,412 A
  • Filed: 11/20/1997
  • Issued: 11/16/1999
  • Est. Priority Date: 11/25/1996
  • Status: Expired due to Fees
First Claim
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1. A microstructure, comprising at least a first and a second wafer which are bonded together, wherein at least one hollow cavity is present in at least one of the wafers and is covered over by the other wafer for formation of a closed hollow cavitywherein an inner pressure of less that 0.1 mbar prevails in the hollow cavity, andwherein surfaces of the wafers that are bonded together are substantially clean surfaces that consist essentially only of the material of the respective wafer and are substantially free of H2 O, H2 and O2.

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