Methods for measuring image-formation characteristics of a projection-optical system

• US 5,985,495 A
• Filed: 03/25/1997
• Issued: 11/16/1999
• Est. Priority Date: 03/25/1996
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Okumura, Masahiko, Wakamoto, Shinji
• Primary Examiner(s): Young, Christopher G.
• Application Number:
  US08/824,219
• Time in Patent Office: 966 Days
• Field of Search: 430/22, 430/30
• US Class Current: 430/22
• CPC Class Codes: G03F 7/2002 with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
• CPC Class Codes: G03F 7/706 Aberration measurement
• CPC Class Codes: G03F 7/70641 Focus
• CPC Class Codes: G03F 7/70691 Handling of masks or workpieces

Abstract

Methods and apparatus are disclosed for exposing a reticle pattern onto a sensitive substrate (such as a sensitized semiconductor wafer) by projection-exposure at high focusing precision. According to the method, multiple evaluation marks are projected onto an area of the surface to form images of the evaluation marks. An image of a measurement mark is projected on or near at least some of the evaluation marks. Respective Z-direction displacements of each evaluation mark relative to a reference plane are detected by detecting a characteristic of the respective measurement mark that varies with a change in position of the measurement mark relative to the respective evaluation mark. Based on such measurements, an axial relationship of the projection-optical system relative to the substrate can be changed to place the substrate at a best-focus position before exposing the substrate with a reticle pattern. Associated apparatus are also disclosed.

Claims

1. A projection-exposure method, comprising the steps:

(a) placing a plurality of points, located on a substrate, within an exposure field of a projection-optical system;

(b) detecting a position of each of the points on the substrate in an axial direction of the projection-optical system;

(c) exposing each of the points on the substrate with an image of a measurement pattern through the projection-optical system so as to form an image of the pattern on the substrate;

(d) obtaining an image-formation characteristic of the projection-optical system based on information pertaining to the pattern formed at the points on the substrate and on the detected positions, when the pattern is exposed, corresponding to the points on the substrate; and

(e) based on the obtained image-formation characteristic, exposing a substrate with an image of a pattern formed on a mask.

2. The method of claim 1, wherein, in step (c), a detection beam, of a detection system that detects a position of the substrate in the axial direction of the projection-optical system, is directed at the substrate within the exposure field at an angle to an optical axis of the projection-optical system.

3. A method for measuring an image-formation characteristic of a projection-optical system, comprising the steps:

(a) arranging a substrate on an image-plane side of the projection-optical system;

(b) detecting a position of each of a plurality of measurement points on the substrate in an axial direction of the projection-optical system;

(c) exposing each of the measurement points, situated on the substrate within an exposure field of the projection-optical system, with an image of a measurement pattern through the projection-optical system; and

(d) obtaining an image-formation characteristic of the projection-optical system based on information concerning the pattern formed at the measurement points on the substrate and on the detected positions, when the pattern is exposed, corresponding to the measurement points on the substrate.

4. The method of claim 3, wherein each of a number and an arrangement of the points on the substrate in the axial direction of the projection-optical system is selected to correspond with a desired measurement precision of the projection-optical system.

5. The method of claim 3, wherein the image-formation characteristic is an image-surface curvature.

6. The method of claim 3, wherein step (c) is performed using a detection system comprising a sensor element for detecting light reflected from the measurement points on the substrate.

7. The method of claim 6, further comprising the step, before step (a), of calibrating the sensor element.

8. The method of claim 7, wherein calibration of the sensor element is performed by a method in which a bias signal is added as required to an output signal of the sensor element.

9. A projection-exposure method, comprising the steps:

(a) placing a plurality of points, located on a substrate, within an exposure field of a projection-optical system;

(b) detecting a position of each of the points on the substrate in an axial direction of the projection-optical system and producing an electrical signal corresponding to each respective detected position;

(c) exposing each of the points on the substrate with an image of a measurement pattern through the projection-optical system so as to form an image of the pattern on the substrate;

(d) obtaining an image-formation characteristic of the projection-optical system based on information pertaining to the pattern formed at the points on the substrate and on the detected positions, when the pattern is exposed, corresponding to the points on the substrate; and

(e) adjusting the signals produced by the detection system based on the desired image-formation characteristic.

10. A projection-exposure method, comprising the steps:

(a) placing a plurality of points, located on a substrate, within an exposure field of a projection-optical system;

(b) detecting a position of each of the points on the substrate in an axial direction of the projection-optical system;

(c) exposing each of the points on the substrate with an image of a measurement pattern through the projection-optical system so as to form an image of the pattern on the substrate;

(d) obtaining an image-formation characteristic of the projection-optical system based on information pertaining to the images formed at the points on the substrate and on the detected positions, when a pattern is exposed, corresponding to the pattern formed on the substrate; and

(e) based on the obtained image-formation characteristic, controlling an inclination angle of a lens of the projection-optical system.