Semiconductor device packaging and method of fabrication

• US 5,987,358 A
• Filed: 02/17/1998
• Issued: 11/16/1999
• Est. Priority Date: 02/17/1998
• Status: Expired due to Fees

• Current Assignee: Intermedics Incorporated
• Original Assignee: Intermedics Incorporated
• Inventors: Gibson, Dennis, Chen, Philip H., Ulmer, Kenneth R., Sosebee, Thomas G.
• Primary Examiner(s): Kamm, William E.
• Assistant Examiner(s): LAYNO, CARL HERNANDZ
• Application Number:
  US09/024,541
• Time in Patent Office: 637 Days
• Field of Search: 607/36, 607/5
• US Class Current: 607/36
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19041 being a capacitor

Abstract

A sub-assembly module for surface mounting on an implantable medical device hybrid module is provided. The sub-assembly module includes one or more electronic components mounted on a substrate. Interconnection between the electronic components and the hybrid module is established by bond pads on the upper and lower surfaces of the substrate and thru-substrate conducting plugs connecting respective upper and lower bond pads. The electronic components are encapsulated in a layer of insulating material. The electronic components may be chip-and-wire mounted to the sub-assembly module and the sub-assembly module may, in turn, be surface mounted to the hybrid module, permitting the integration of chip-and-wire and surface mount processing for a given hybrid module.

Claims

1. A method of fabricating a sub-assembly module for surface mounting on an implantable medical device hybrid module, comprising the steps of:

providing a substrate;

coupling a first conductor to the substrate;

coupling a second conductor to the substrate;

coupling an electronic component to the substrate and connecting the electronic component between the first and second conductors; and

applying a layer of insulating material on the electronic component and the first and second conductors.

2. The method of claim 1, wherein the step of coupling the electronic component comprises applying a layer of conductive epoxy to the substrate and placing the electronic component on the conductive epoxy.

3. The method of claim 1, wherein the step of applying the layer of insulating material comprises encircling the substrate with a form, pouring the insulating material into the form until the electronic component and the first and second conductors are covered, and hardening the material by heating.

4. The method of claim 1, wherein the step of connecting the electronic component to the second conductor comprises coupling a bonding wire between the electronic component and the second conductor.

6. The sub-assembly module of claim 1, wherein the electronic component comprises an integrated circuit.

7. The sub-assembly module of claim 1, wherein the electronic component comprises a diode.

5. A cardiac stimulator comprising:

a can;

a hybrid module disposed in the can; and

a sub-assembly module coupled to the hybrid module, the sub-assembly module having a substrate, a first conductor coupled to the substrate, a second conductor coupled to the substrate, an electronic component coupled to the substrate and being connected between the first conductor and the second conductor, a bonding wire connecting the electronic component to the second conductor, and a layer of insulating material coupled to the substrate and encapsulating the electronic component and the first and second conductors.