Electronic component cooling using a heat transfer buffering capability

• US 5,987,890 A
• Filed: 06/19/1998
• Issued: 11/23/1999
• Est. Priority Date: 06/19/1998
• Status: Expired due to Fees

• Current Assignee: Lenovo Singapore Pte Limited (Lenovo Group Ltd.)
• Original Assignee: International Business Machines Company (International Business Machines Corporation)
• Inventors: Hougham, Gareth Geoffrey, Mok, Lawrence Shungwei, Chiu, George Liang-Tai
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): SHULMAN, MARK S
• Application Number:
  US09/100,906
• Time in Patent Office: 522 Days
• Field of Search: 62/259.2, 62/3.2, 361/700, 165/104.33
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: G05D 23/1919 characterised by the type of controller
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Heat transfer out of a housing for a locallized source of heat such as that produced by a semiconductor chip of electronic apparatus is provided by a low thermal impedance heat transfer member such as a heat pipe, a thermal reservoir or heat transfer buffering member and a Peltier effect device interfaced with the thermal reservoir and the ambient surrounding the housing so as to provide a refrigeration function for the thermal reservoir. A high heat capacity or high latent heat of phase transition material can be used for the thermal reservoir. In a portable computer with a battery power supply, the thermal reservoir can be independent or the battery can be employed in the thermal reservoir functions.

Claims

1. In electronic apparatus having within a housing, a localized source of heat,

the improvement comprising:

a thermal reservoir member positioned in said electronic apparatus housing,

low thermal impedance means adapted for transferring heat from said localized heat source into said thermal reservoir member, and,

a Peltier effect refrigerating member having first and second hot portions and a cold portion and electrical input contacts to said first and second hot portions,

said Peltier effect refrigerating member being positioned in said housing with said first and second hot portions and said electrical input contacts exposed outside said housing and said cold portion being in good thermal transfer contact with said thermal reservoir member.

2. The improvement of claim 1 wherein said low thermal impedance means is a heat pipe.

3. The improvement of claim 2 wherein said locallized source of heat is an electronic component of said apparatus.

4. The improvement of claim 3 wherein said apparatus is a portable computer and said housing has a base and cover.

5. The improvement of claim 4 wherein said locallized source of heat is a semiconductor chip located in said base.

6. A buffering capability for heat occurring at a first rate at a locallized source in a housing for dissipation at a second rate that is different from said first rate into the ambient surrounding the housing;

comprising in combination;

a thermal reservoir member capable of storage of heat positioned in said housing,

a low thermal impedance heat transfer member adapted for transfer of said heat occurring at said locallized source to said thermal reservoir, and,

a Peltier effect refrigerating member having a good thermal transfer interface with said thermal reservoir and having electrical and thermal members extending into said ambient surrounding said housing for heat transfer to said ambient at said second rate.

7. The buffering capability of claim 6 wherein said storage of heat in said thermal reservoir includes a latent heat through phase transition property of the material in said thermal reservoir.

8. The buffering capability of claim 7 wherein said locallized source of heat is a semiconductor chip.

9. The buffering capability of claim 8 wherein said low impedance heat transfer is with a heat pipe.

10. The buffering capability of claim 9 wherein said housing is the housing of a portable computer and said ambient surrounds the outside of said housing.

15. The buffering capability of claim 6 wherein said thermal reservoir member is at least one battery.

11. In electronic apparatus having within a computer base type housing, a component chip source of heat,

the improvement for heat transfer buffering comprising:

a thermal reservoir battery member positioned in said housing,

low thermal impedance heat pipe means for transferring heat from said chip into said thermal reservoir battery member, and,

a Peltier effect refrigerating member having a cold portion and first and second hot portions, with electrical input connections to said first and second hot portions,

said Peltier effect refrigerating member being positioned in said housing with said first and second hot portions and said electrical input contacts exposed outside said housing and said cold portion being in good thermal transfer contact with said thermal reservoir battery member.

12. A buffering capability for heat occurring at a first rate at a computer chip in a portable computer housing that is surrounded by an ambient, for dissipation at a second rate that is different from said first rate, into said ambient;

comprising in combination;

a portable computer power supply battery type thermal reservoir member, said reservoir member being capable of storage of heat that includes latent heat through a phase transition of a material in said battery type thermal reservoir,

a low thermal impedance heat pipe adapted for transfer of said heat from said computer chip to said battery type thermal reservoir, and,

a Peltier effect refrigerating member having a good thermal transfer interface with said battery type thermal reservoir and having electrical and thermal members extending into said ambient for heat transfer at said second rate.

13. The process of extracting heat from a component of an electronic apparatus positioned in a housing that is surrounded by an ambient,

comprising in combination the steps of:

providing a thermal reservoir heat storage capability positioned in said housing,

delivering heat from said component to said thermal reservoir heat storage capability through a heat pipe, and,

controlling delivery of heat stored in said thermal reservoir heat storage capability to said ambient by a Peltier effect refrigerating member having a cold portion and first and second hot portions with electrical contacts to said first and second hot portions,

said Peltier effect refrigerating member having said cold portion in good thermal contact with said thermal reservoir heat storage capability, and having said first and second hot portions and said electrical contacts, extending through said housing to said ambient.

14. The process of claim 13 wherein said thermal reservoir heat storage capability is at least one battery.