Wafer transfer robot

• US 5,988,971 A
• Filed: 07/09/1997
• Issued: 11/23/1999
• Est. Priority Date: 07/09/1997
• Status: Expired due to Term

• Current Assignee: ADE Optical Systems Corporation
• Original Assignee: ADE Optical Systems Corporation
• Inventors: Johnson, Kirk Rodney, Poduje, Noel Stephen, Fossey, Michael E.
• Primary Examiner(s): Bucci, David A.
• Application Number:
  US08/890,575
• Time in Patent Office: 867 Days
• Field of Search: 414/416, 414/225, 414/938, 414/941, 414/811, 294/103.1, 294/907, 901/35, 901/39
• US Class Current: 414/416.01
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: Y10S 294/907 Sensor controlled device
• CPC Class Codes: Y10S 414/138 Wafers positioned vertically within cassette
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

In one aspect, the present invention provides an apparatus for transferring wafers to or from a wafer cassette having a plurality of wafer-receiving slots, wherein the apparatus comprises a wafer paddle which is adapted to be inserted into a wafer cassette alongside a wafer. Edge grippers carried by the wafer paddle releasible grip the wafer by its edges. A first capacitive sensor carried by the wafer paddle is oriented in a first direction for sensing information about a wafer in a wafer receiving slot of the wafer cassette. A second capacitive sensor carried by the wafer paddle is oriented in a direction perpendicular to the first direction for sensing additional proximity information about a wafer in a wafer receiving slot of the cassette. A transport mechanism produces movement of the wafer paddle along at least three axes of movement to permit transferring wafers to or from respective wafer receiving slots of the wafer cassette. In a more specific aspect, the transport mechanism produces movement along five axes: relative translational movement along orthogonal x, y and z axes, rotational movement about a rotational axis, and tilting movement of the wafer paddle about a paddle tilt axis.

Claims

1. Apparatus for transferring wafers to or from a wafer cassette having a plurality of wafer-receiving slots, said apparatus comprising:

a wafer paddle adapted to be inserted into a wafer cassette alongside a wafer;

edge grippers carried by said wafer paddle for releasably gripping the wafer by its edges;

a first noncontact sensor carried by said wafer paddle and oriented in a first direction for sensing first position information about a wafer in a wafer-receiving slot of the wafer cassette;

a second noncontact sensor carried by said wafer paddle and oriented in a second direction for sensing second position information about a wafer in a wafer-receiving slot of the cassette;

a transport mechanism for producing movement of said wafer paddle along at least three axes of movement to permit transferring wafers to or from respective wafer-receiving slots of the wafer cassette; and

a controller operatively connected to said first and second sensors for receiving position signals therefrom, the controller being connected to said transport mechanism and operable to control said transport mechanism so as to adjust positioning of said paddle during a transfer operation in response to the position signals when either or both of the position signals indicate misalignment of the paddle with respect to the wafer.

2. Apparatus according to claim 1, wherein said transport mechanism includes means for producing relative translational movement along orthogonal x and y axes, and also for producing tilting movement of said wafer paddle along a paddle tilt axis.

3. Apparatus according to claim 2, wherein said transport mechanism includes means for producing movement along five axes:

relative translational movement along orthogonal x, y and z axes, rotational movement about a rotational axis, and tilting movement of said wafer paddle about a paddle tilt axis.

4. Apparatus according to claim 3, wherein said transport mechanism comprises a support column mounted for rotational movement about said rotational axis and an arm projecting from said support column, and wherein said wafer paddle is carried by said arm.

5. Apparatus according to claim 4, including a second wafer paddle having edge grippers for releasably gripping the wafer by its edges and being adapted to be inserted into a wafer cassette alongside a wafer, and a second arm projecting from said support column and mounting said second wafer paddle to said support column so that said first and second paddles move as a unit in response to movement of said support column about said rotational axis.

6. Apparatus according to claim 3, wherein said transport mechanism includes an x-y table for producing movement along said x and y axes, and said support column is mounted on said x-y table for translational movement along said x and y axes.

7. Apparatus according to claim 6, wherein said support column includes means for moving said arm along a z axis substantially parallel to said axis of rotation.

8. Apparatus according to claim 1, wherein said wafer paddle is mounted from one end and has a free end adapted to be inserted into a wafer cassette, and wherein said first noncontact sensor is located at said free end of the paddle and oriented for sensing the presence of a wafer beyond said free end of the wafer paddle.

9. Apparatus according to claim 8, wherein said first noncontact sensor comprises at least one capacitive sensor.

10. Apparatus according to claim 8, wherein said first noncontact sensor comprises a pair of capacitive sensors located in spaced relation to one another at said free end of the wafer paddle.

11. Apparatus according to claim 8, wherein said second noncontact sensor is located in a face of said paddle and is oriented outwardly from the face of the paddle in for sensing the presence of a wafer alongside the paddle.

12. Apparatus according to claim 11, wherein said second noncontact sensor comprises at least one capacitive sensor.

13. Apparatus according to claim 11, wherein said second capacitive sensor comprises three capacitive sensors located in a triangular arrangement on said face of the paddle.

14. Apparatus for transferring wafers, said apparatus comprising:

a wafer cassette having a plurality of wafer-receiving slots;

a wafer paddle positionable adjacent said wafer cassette alongside a wafer-receiving slot for being inserted into said wafer cassette alongside a wafer;

edge grippers carried by said wafer paddle for releasably gripping the wafer by its edges;

a capacitive sensor carried by said wafer paddle and oriented facing said wafer cassette for sensing a wafer in said cassette and providing a position signal indicative of presence of said wafer;

a transport mechanism for producing relative translational movement between said wafer cassette and said wafer paddle so as to scan said capacitive sensor past successive wafer-receiving slots of the wafer cassette; and

a controller connected with said capacitive sensor for logging information about wafers in successive wafer-receiving slots of the wafer cassette, the controller being operatively connected with said transport mechanism and operable to control said transport mechanism so as to position said paddle proximate a wafer in order to permit said paddle to be inserted into said cassette alongside the wafer and to adjust positioning of said paddle when said position signal indicates misalignment of the paddle with respect to the wafer.

15. Apparatus according to claim 14, wherein said controller includes means for mapping the wafer positions in the respective wafer-receiving cassette slots upon scanning of said capacitive sensor along said wafer cassette.

16. Apparatus according to claim 14, wherein said controller includes means for determining the presence or absence of a wafer in a given cassette slot and means for detecting a mis-loaded wafer in a given cassette slot.

17. Apparatus according to claim 14, wherein the wafer-receiving slots of said wafer cassette are oriented for holding the respective wafers in a generally vertical plane for insertion or removal from above, and said wafer paddle is located above the wafer cassette with said capacitive sensor facing downwardly for sensing a wafer therebelow.

18. Apparatus according to claim 17, additionally including a transport mechanism for inserting the wafer paddle vertically into the wafer cassette alongside a wafer, and a side-looking capacitive sensor carried by said wafer paddle and cooperating with said transport mechanism for providing information to assist in positioning the wafer paddle relative to the wafer during wafer pick-up.

19. Apparatus for transferring wafers, said apparatus comprising:

a wafer cassette having a plurality of generally vertically oriented wafer-receiving slots arranged for holding wafers in spaced apart relationship in a generally vertical orientation;

a paddle support positionable above said wafer cassette;

a wafer paddle having an upper end carried by said paddle support, a free lower end, and a substantially planar body;

said wafer paddle being oriented parallel to the slots of said cassette to permit insertion of the paddle downwardly into a slot of said cassette alongside a wafer;

edge grippers carried by said wafer paddle for releasably gripping the wafer by its edges;

a plurality of spaced-apart capacitive sensors carried by said substantially planar paddle body and oriented laterally in a direction perpendicular to the paddle surface for sensing wafer proximity when the paddle is inserted into said cassette alongside a wafer;

a transport mechanism for moving said paddle into said cassette alongside a wafer and being operable to move said paddle about a tilt axis; and

a controller connected to said capacitive sensors and operatively connected to said transport mechanism, the controller being operable to detect when said paddle is non-parallel to the plane of the wafer based on signals from said capacitive sensors and to cause said transport mechanism to move said paddle about the tilt axis to bring said paddle into an orientation parallel to the plane of the wafer.

20. Apparatus according to claim 19, wherein said transport mechanism is operable to move said paddle support along orthogonal x, y and z axes relative to said wafer cassette.

21. Apparatus according to claim 20, further comprising a pair of downwardly-looking capacitive sensing elements mounted at said free end of said paddle and located in spaced relation to one another for sensing wafer proximity at two spaced locations along the top edge of a wafer.

22. Apparatus for grasping and transferring wafers comprising:

a paddle support;

a wafer paddle having one end carried by said paddle support, an opposite free end, and a substantially planar surface adapted to positioned alongside a wafer;

edge grippers carried by said planar surface said wafer paddle for releasably gripping the wafer by its edges;

a first capacitive sensor carried by said wafer paddle at said free end thereof and oriented for sensing first wafer proximity information in a direction parallel to the paddle surface;

a second capacitive sensor carried by said wafer paddle on said planar surface thereof and oriented for sensing second wafer proximity information in a direction perpendicular to the paddle surface;

a transport mechanism for moving said paddle along a plurality of directions including directions parallel to and perpendicular to the paddle surface; and

a controller coupled with said transport mechanism and arranged to receive signals from said first and second capacitive sensors, said controller being operable to cause said transport mechanism to adjust positioning of said paddle when the signal from at least one of said capacitive sensors indicates misalignment of said paddle with respect to a wafer.

23. Apparatus according to claim 22, wherein said edge grippers include a pair of stationary edge grippers projecting from said surface of said paddle and positioned for engaging a wafer at two spaced locations on its edge, and a movable edge gripper positioned in spaced relation to said stationary edge grippers and mounted for movement toward or away therefrom to permit engaging an opposite edge of the wafer, and wherein said apparatus further comprises a third capacitive sensor cooperating with said movable gripper for providing information about the proximity of the movable gripper to the wafer edge.