Gold-alloy bonding wire
First Claim
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1. A thin wire of gold alloy for wire bonding, consisting of:
- 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium; and
the balance consisting of gold and unavoidable impurities.
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Abstract
A thin wire of gold alloy for wire bonding, consisting of: a first group consisting of 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium; and the balance consisting of gold and unavoidable impurities. The thin wire has a loop height of 200 μm or more and a wire flow after resin molding of not more than 5%.
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Citations
3 Claims
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1. A thin wire of gold alloy for wire bonding, consisting of:
2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium; and
the balance consisting of gold and unavoidable impurities.
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2. A thin wire of gold alloy for wire bonding, consisting of:
2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium;
at least one component selected from the group consisting of 1 to 5 ppm by weight of calcium, 1 to 5 ppm by weight of yttrium, 1-5 ppm by weight of at least one of rare earth metals, and 10 to 50 ppm by weight of germanium; and
the balance consisting of gold and unavoidable impurities.
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3. A thin wire of gold alloy for wire bonding, consisting of:
a first group of components consisting of 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium and at least one component selected from the group consisting of 1 to 5 ppm by weight of calcium, 1 to 5 ppm by weight of yttrium, 1-5 ppm by weight of at least one of rare earth metals, and 10 to 50 ppm by weight of germanium;
5 to 50 ppm by weight of silver;
5 to 30 ppm by weight of palladium;
5 to 40 ppm by weight of copper; and
the balance consisting of gold and unavoidable impurities.
Specification