×

Gold-alloy bonding wire

  • US 5,989,364 A
  • Filed: 12/12/1994
  • Issued: 11/23/1999
  • Est. Priority Date: 04/22/1993
  • Status: Expired due to Term
First Claim
Patent Images

1. A thin wire of gold alloy for wire bonding, consisting of:

  • 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium; and

    the balance consisting of gold and unavoidable impurities.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×