Segment connections for multiple elevation transducers

• US 5,990,598 A
• Filed: 09/23/1997
• Issued: 11/23/1999
• Est. Priority Date: 09/23/1997
• Status: Expired due to Fees

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Sudol, Wojtek, Gurrie, Francis E.
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US08/935,744
• Time in Patent Office: 791 Days
• Field of Search: 310/322, 310/334, 310/327, 310/333, 310/365, 310/366
• US Class Current: 310/334
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A connection assembly for use in a multiple aperture ultrasonic transducer including an array of elements for transmitting and receiving wherein each element includes a plurality of segments and the connection assembly interconnects the segments of the elements and the segments to transmit/receive circuits to form the apertures of the array. The connection assembly includes an isolating layer superimposed on the segments with at least one via opening located within the area of each segment and a conductive layer superimposed on the isolating layer with conductive paths interconnecting the segments and the segments to the transmit/receive circuits to form the apertures of the array. The conductive layer forms a continuous layer covering the isolating layer, the interior surfaces of the via openings and the areas of the segments exposed through the via openings and is scribed to divide the conductive layer into the conductive paths. The conductive paths associated with each element are separated from the conductive paths associated with neighboring elements by the dicing cuts that divide the elements and segments from one another. A flex circuit is assembled coplanar with the segments and the isolating and conductive layers are superimposed on the elements and flex circuit so that the connections between the segments and flex leads are accomplished by the same processes.

Claims

1. A multiple aperture ultrasonic transducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and a connection assembly for interconnecting the segments of each element and for connecting the segments to transmit/receive circuits to form the apertures of the array the connection assembly comprising:

an isolating layer superimposed on the segments of the array,

the isolating layer having at least one via opening corresponding to and located within the area of each segment of the array, each via opening exposing a corresponding area of the corresponding segment, and

a conductive layer superimposed on the isolating layer and having conductive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array, wherein

the conductive layer is superimposed on and continuously covers the isolating layer, the interior surfaces of the via openings and the areas of the segments exposed through the via openings, and

is scribed to divide the conductive layer into the conductive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array.

2. The connection assembly of claim 1 wherein the conductive layer is a deposited conductive layer.

3. The connection assembly of claim 2 wherein the conductive layer is deposited by a sputtering process.

4. A multiple aperture ultrasonic transducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and a connection assembly for interconnecting the segments of each element and for connecting the segments to transmit/receive circuits to form the apertures of the array, the connection assembly comprising:

an isolating layer superimposed on the segments of the array,

the isolating layer having at least one via opening corresponding to and located within the area of each segment of the array each via opening exposing a corresponding area of the corresponding segment, and

a conductive layer superimposed on the isolating layer and having conductive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array, wherein

the conductive paths associated with the segments of each element are separated from the conductive paths associated with the segments of each adjacent element by a dicing cut that separates the portion of the isolating layer and the conductive layer superimposed on the segments of each element from the portion of the isolating layer and the conductive layer superimposed on the segments of each adjacent element.

5. A multiple aperture ultrasonic transducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and a connection assembly for interconnecting the segments of each element and for connecting the segments to transmit/receive circuits to form the apertures of the array, the connection assembly comprising:

an isolating layer superimposed on the segments of the array,

the isolating layer having at least one via opening corresponding to and located within the area of each segment of the array, each via opening exposing a corresponding area of the corresponding segment, and

a conductive layer superimposed on the isolating layer and having conductive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array, wherein

the isolating layer and the conductive layer are superimposed upon a flex circuit coplanar with the segments and with via openings through the isolating layer in the area of the flex circuit and wherein the conductive layer is scribed to provide connections between the segments and flex leads formed on the flex circuit.