Circuit board having an integral sorber

• US 5,992,168 A
• Filed: 04/29/1999
• Issued: 11/30/1999
• Est. Priority Date: 09/20/1995
• Status: Expired due to Term

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Pfister, Dennis M., Byrd, Charles M.
• Primary Examiner(s): DOERRLER, WILLIAM CHARLES
• Application Number:
  US09/303,085
• Time in Patent Office: 215 Days
• Field of Search: 62/480, 62/497, 62/259.2, 62/101, 361/688, 361/689, 361/700, 361/704, 361/714, 361/720
• US Class Current: 62/259.2
• CPC Class Codes: F25B 17/08 the absorbent or adsorbent being a solid, e.g. salt F25B17/12 takes precedence
• CPC Class Codes: F25B 2333/005 the generator or boiler uses electromagnetic energy in the form of microwaves for desorbing the sorbate from the sorbate/sorbent compound
• CPC Class Codes: F25B 35/04 using a solid as sorbent
• CPC Class Codes: F25B 39/026 specially adapted for sorption type systems
• CPC Class Codes: F25B 49/046 Operating intermittently
• CPC Class Codes: F25D 23/12 Arrangements of compartments additional to cooling compartments; Combinations of refrigerators with other equipment, e.g. stove
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05B 6/701 using microwave applicators
• CPC Class Codes: H05B 6/802 for heating fluids methods of heating fluids in conventional microwave ovens H05B6/687
• CPC Class Codes: H05B 6/808 Microwave heating adapted for vending machines
• CPC Class Codes: H05K 7/20363 Refrigerating circuit comprising a sorber

Abstract

An apparatus for cooling an electrical component is disclosed which comprises a sorber containing a sorbent; a condenser in fluid communication with the sorber; an evaporator in fluid communication with both the sorber and the condenser and connected in heat-exchange relation to the electrical component; wherein a sorbate which has been condensed in the condenser is evaporated in the evaporator, thereby absorbing heat from the electrical component, and then adsorbed onto the sorbent; an electromagnetic wave generator, a waveguide coupler for directing the electromagnetic waves to the sorbent; wherein the sorbate is desorbed from the sorbent by the electromagnetic waves and condensed in the condenser; and wherein the desorption of the sorbate from the sorbent is substantially isothermal.

Claims

1. A sorber comprising:

a circuit board substrate;

wherein said circuit board substrate has an enclosure formed therein, and

wherein said circuit board substrate has a port therein for transporting a sorbate into and out of said enclosure;

a sorbent located within said enclosure; and

a first conductor located on a first side of said enclosure.

2. The sorber of claim 1 further comprising a second conductor located on a second side of said enclosure opposite said first side.

3. The sorber of claim 1 wherein said first conductor is located on a first side of said circuit board substrate.

4. The sorber of claim 3 wherein said first conductor is a stripline conductor and wherein said said second conductor is a ground plane conductor.

5. The sorber of claim 1 further comprising a filter located between said sorbent and said port.

6. A sorption cooling system comprising:

a sorber formed within a circuit board substrate;

an electromagnetic wave generator coupled to said sorber;

a condenser coupled to said sorber; and

an evaporator coupled to said condenser and said sorber.

7. The sorption cooling system of claim 6

wherein said sorber comprises an enclosure within said circuit board substrate;

wherein said enclosure contains a sorbent;

wherein said circuit board substrate has a port for conveying a sorbate into and out of said enclosure;

wherein during a desorb cycle,

electromagnetic waves generated by said electromagnetic waves generator are conveyed to said sorber to desorb said sorbate,

said sorbate is conveyed from said enclosure to said condenser, and

said sorbate is condensed in said condenser; and

wherein during an adsorb cycle,

said sorbate is evaporated in said evaporator to produce a cooling effect,

said sorbate is conveyed from said evaporator to said enclosure, and

said sorbate is adsorbed onto said sorbent to form a sorbate/sorbent compound.

8. The sorption cooling system of claim 7 wherein said electromagnetic wave generator is configured to desorb said sorbate without heating said sorbate/sorbent compound to a degree sufficient to thermally desorb said sorbate.

9. The sorption cooling system of claim 7 wherein said electromagnetic wave generator comprises a solid state electromagnetic wave generator.

10. The sorption cooling system of claim 9 wherein said solid state electromagnetic wave generator comprises a stripline microwave amplifier circuit.

11. The sorption cooling system of claim 9 wherein said solid state electromagnetic wave generator comprises a radio frequency oscillator.

12. The sorption cooling system of claim 7 wherein said sorber further comprises at least one stripline positioned on one side of said enclosure, and wherein an output of said electromagnetic wave generator is directly connected to said at least one stripline.

13. A method for constructing a sorber within a circuit board substrate comprising:

forming a chamber in said circuit board substrate;

placing a sorbent in said chamber;

sealing said chamber to form an enclosure;

forming a port in said circuit board substrate, wherein said port is in communication with said enclosure; and

forming a stripline conductor on a first side of said enclosure.

14. The method of claim 13 further comprising forming a ground plane conductor on a second side of said enclosure opposite said first side.

15. The method of claim 13 wherein said chamber is formed in said circuit board substrate by etching said chamber in said circuit board substrate.