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Silicon wafer or die strength test fixture using high pressure fluid

  • US 5,992,242 A
  • Filed: 05/04/1998
  • Issued: 11/30/1999
  • Est. Priority Date: 05/04/1998
  • Status: Expired due to Term
First Claim
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1. A method of testing an integrated circuit (IC) wafer comprising the steps of:

  • providing an IC wafer;

    providing a wafer test fixture, the wafer test fixture having a base plate and a top plate;

    holding the wafer between the base plate and top plate;

    sealably attaching the wafer to the base plate so as to form a first cavity underneath the wafer;

    sealably attaching the wafer to the top plate so as to form a second cavity above the wafer;

    pressurizing the first cavity to stress the wafer;

    measuring the pressure in the pressurized cavity; and

    measuring the deflection of the integrated circuit wafer from the pressurized cavity.

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