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Apparatus for molding microsystem structures

  • US 5,993,189 A
  • Filed: 10/20/1997
  • Issued: 11/30/1999
  • Est. Priority Date: 11/26/1996
  • Status: Expired due to Term
First Claim
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1. In an apparatus for molding microsystem structures having a pair of oppositely lying chamber parts of a closable chamber, which serve as carriers for receiving an embossing tool and a moldable material, and of which one chamber part is fixed to a frame and the other is guided adjustably in said frame, an improvement comprising that:

  • said chamber has side walls which are separated into an inner wall part and an outer wall part,said inner wall part and said outer wall part both being supported by said fixed chamber part;

    said outer wall part has an outwardly facing axial end face on which the adjustable chamber part comes to bear against the force of a spring during closing of said chamber, and is movable relative to the inner wall part and displaceable in an adjustable direction towards and away from said fixed chamber part;

    guide elements mounted on the fixed chamber part for guiding the displacement of said outer wall part in said adjustment direction between two stops, a first of which determining a maximal and the second of which determining a minimal distance between said outer wall part and said fixed chamber part, said guide elements also forming said first stop,said inner wall part is formed by a first cylindrical flange, andsaid outer wall part is formed by a second cylindrical flange enclosing the first cylindrical flange with an inner lateral surface and has a radial widening being provided with through bores, with said guide elements extending through said through bores which serve as a guide for said outer wall part during displacement.

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