Method of making a fiberglass reinforced resin plate

• US 5,994,167 A
• Filed: 05/21/1997
• Issued: 11/30/1999
• Est. Priority Date: 05/21/1997
• Status: Expired due to Term

• Current Assignee: ZOWIE Technology Corporation
• Original Assignee: ZOWIE Technology Corporation
• Inventors: Tai, George, Jone, El-Pon, Lin, Max
• Primary Examiner(s): DUTTON, BRIAN KEITH
• Application Number:
  US08/861,391
• Time in Patent Office: 923 Days
• Field of Search: 438/51, 438/109, 200/5, 361/807
• US Class Current: 438/109
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The subject invention relates to a method of production of fiberglass reinforced resin plate type semi-conductor diodes, by which the lead wiring of semi-conductor diode is directly included in the production of fiberglass reinforced resin (FRP) foundation plate, to supersede conventional lead frame, to enable the designing of any styles to suit actual needs, and with the design of connecting holes, several layers of different circuits can be connected to comprise 3-dimensional multi-layer circuits.

Claims

1. A method of production of fiberglass reinforced resin plate semi-conductor diodes having electrodes including the steps of:

(a) establishing a conductive circuit on a fiberglass reinforced resin foundation plate;

(b) providing a mounting site on said foundation plate;

(c) mounting said semi-conductor diodes on said foundation plate;

(d) connecting said electrodes of said semi-conductor diodes to said foundation plate;

(e) stacking a plurality of said foundation plates and respective connected semi-conductor diodes to form a plurality of foundation plate layers;

(f) press forming said plurality of foundation plate layers each to the other; and

,

(g) cutting extraneous material from said plurality of foundation plates.