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Controlled cleavage process using pressurized fluid

  • US 5,994,207 A
  • Filed: 02/19/1998
  • Issued: 11/30/1999
  • Est. Priority Date: 05/12/1997
  • Status: Expired due to Term
First Claim
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1. A process for forming a film of material from a substrate, said process comprising steps of:

  • introducing particles in a selected manner through a surface of a substrate to a selected depth underneath said surface, said particles being at a concentration at said selected depth to define a substrate material to be removed above said selected depth, said selected manner providing a patterned distribution of particles at said selected depth to enhance said controlled cleaving action; and

    providing energy using a fluid to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate, whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate.

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