Three-dimensional molded sockets for mechanical and electrical component attachment

• US 5,994,648 A
• Filed: 03/27/1997
• Issued: 11/30/1999
• Est. Priority Date: 03/27/1997
• Status: Expired due to Fees

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Ford Motor Company
• Inventors: Glovatsky, Andrew Z., Van Pham, Cuong, Todd, Michael G.
• Primary Examiner(s): SOUGH, HYUNG SUB
• Application Number:
  US08/826,461
• Time in Patent Office: 978 Days
• Field of Search: 174/254, 174/260, 174/261, 361/749, 361/761, 361/763, 361/764, 361/773, 361/774, 361/803, 439/67, 439/68, 439/74, 439/77
• US Class Current: 174/260
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/119 Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/09845 Stepped hole, via, edge, bump or conductor
• CPC Class Codes: H05K 2201/1059 Connections made by press-fit insertion
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10651 Component having two leads, e.g. resistor, capacitor
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component'"'"'s terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

Claims

1. An electrical circuit assembly, comprising:

an electronic component having a body with springlike leads projecting from at least one edge of said body, said leads being inwardly and resiliently deflectable toward said body;

a molded substrate having a generally curviplanar first surface with circuit traces thereon and a cavity formed therein, said cavity substantially conforming in shape with said electronic component; and

a plurality of electrical contacts arranged proximate said cavity, said contacts being arranged in matched relation with said springlike leads of said electronic component, at least one of said electrical contacts being connected to at least one circuit trace on said substrate;

wherein said cavity and said electrical contacts are dimensioned such that an interference fit is provided between said electrical contacts and said springlike leads of said electronic component, such that said electronic component is held within said cavity when said component is positioned therein;

said electronic component being disposed in said cavity such that said springlike leads are in physical and electrical connection with their respective electrical contacts;

wherein said substrate includes a lip located at an intersection between inner walls of said cavity and said first surface of said substrate, said lip extending a predetermined distance into said cavity, wherein each of said springlike leads is bent so as to provide an outwardly extending nib thereon, each nib being positioned along each of said springlike leads such that each nib is seated underneath and in contact with said lip when said component is positioned in said cavity.

2. An electrical circuit assembly according to claim 1, further comprising an adhesive placed between a bottom surface of said electronic component and a surface of said cavity.

3. An electrical circuit assembly according to claim 1, further comprising an overmolding of electrically-insulative material sealably covering said electronic component and a portion of said substrate peripherally adjacent said electronic component.

4. An electrical circuit assembly according to claim 3, wherein said overmolding has a coefficient of thermal-expansion substantially equivalent to a coefficient of thermal expansion of said substrate.

5. An electrical circuit assembly according to claim 1, further including:

circuit traces arranged on a second surface of said substrate; and

conductive paths disposed between said first and second surfaces of said substrate, so as to electrically connect at least one of said electrical contacts with a respective circuit trace on said second surface of said substrate.

6. An electrical circuit assembly according to claim 1, wherein said cavity and said electrical contacts are dimensioned such that when said electronic component is positioned within said cavity, a top surface of said electronic component is substantially flush with said first surface of said substrate.

7. An electrical circuit assembly according to claim 1, wherein said electrical contacts are composed of a metal substantially inert to oxidation.

8. An electrical circuit assembly according to claim 7, wherein said metal includes at least one metal selected from the group consisting of gold, palladium, tin, lead, and bismuth.

9. An electrical circuit assembly according to claim 1, wherein said electrical contacts are composed of a substantially malleable alloy.

10. An electrical circuit assembly according to claim 1, wherein said substrate includes internal voids formed therein proximate internal walls of said cavity.

11. An electrical circuit assembly, comprising:

an electronic component having terminations arranged on at least one surface thereof;

a molded substrate having a generally curviplanar first surface with circuit traces thereon and a cavity formed therein, said cavity substantially conforming in shape with said electronic component, wherein said molded substrate further includes internal voids formed therein proximate internal walls of said cavity; and

a plurality of electrical contacts arranged proximate said cavity, said contacts being arranged in matched relation with said terminations of said electronic component, at least one of said electrical contacts being connected to at least one circuit trace on said substrate;

wherein said cavity and said electrical contacts are dimensioned such that an interference fit is provided between said electrical contacts and said terminations of said electronic component, such that said electronic component is held within said cavity when said component is positioned therein;

said electronic component being disposed in said cavity such that said terminations are in physical and electrical connection with their respective electrical contacts.

12. An electrical circuit assembly for use with an electronic component, comprising:

a molded substrate having a first surface;

a plurality of circuit traces disposed on said first surface;

a cavity defined in said first surface;

a plurality of electrical contacts arranged proximate said cavity, at least one of said electrical contacts being connected to at least one of said circuit traces; and

at least one internal void formed in said molded substrate proximate internal walls of said cavity.

13. An electrical circuit assembly for use with an electronic component according to claim 12, wherein said cavity substantially conforms in shape with the electronic component.

14. An electrical circuit assembly for use with an electronic component according to claim 12, wherein said contacts are arranged in matched relation with terminations of the electronic component.