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Micro-opto-electromechanical devices and method therefor

  • US 5,995,688 A
  • Filed: 06/01/1998
  • Issued: 11/30/1999
  • Est. Priority Date: 06/01/1998
  • Status: Expired due to Term
First Claim
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1. An article comprising:

  • a micro-electromechanical systems chip comprising a first substrate having a micro-electromechanical device and a first plurality of bonding sites disposed on a first surface thereof; and

    an optical bench chip comprising a second substrate having an optical device and a second plurality of bonding sites disposed on a first surface thereof;

    wherein,the first and second substrates are attached at the respective first and second pluralities of bonding sites such that the first surfaces of each substrate are in opposed and spaced relation to one another, and further wherein the micro-electromechanical device and the optical device communicate with one another either mechanically or electromagnetically.

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