Micro-opto-electromechanical devices and method therefor

• US 5,995,688 A
• Filed: 06/01/1998
• Issued: 11/30/1999
• Est. Priority Date: 06/01/1998
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Barber, Bradley P., Gammel, Peter L., Aksyuk, Vladimir A., Bishop, David J., Giles, C. Randy
• Primary Examiner(s): Ullah, Akm E.
• Application Number:
  US09/088,182
• Time in Patent Office: 547 Days
• Field of Search: 385/10-14, 29/890.1, 216/27, 216/33, 216/88, 216/2, 264/619, 264/635, 264/643, 359/630, 359/196, 359/631, 359/712, 359/839, 359/880
• US Class Current: 385/14
• CPC Class Codes: G02B 6/353 the optical element being a shutter, baffle, beam dump or opaque element absorbers on light guide termination G02B6/243
• CPC Class Codes: G02B 6/3552 1x1 switch, e.g. on/off switch
• CPC Class Codes: G02B 6/3566 involving bending a beam, e.g. with cantilever
• CPC Class Codes: G02B 6/3572 Magnetic force magnetic forces controlling reflecting elements in general G02B26/085; magneto-optic devices G02F1/09
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81

Abstract

A micro-opto-electromechanical systems (MOEMS) device comprises a micro-electromechanical systems (MEMS) device and a silicon optical-bench (SiOB) device or system. The MEMS device interacts with the SiOB mechanically or electromagnetically. In one embodiment, the MEMS device is operable to provide a switching function for the SiOB device. The MEMS device comprises an actuator that is mechanically linked to an optical interruptor that prevents at least a portion of an optical signal incident thereon from propagating therethrough. In an actuated state, the actuator causes the optical interrupter to move into an optical path of an optical signal traveling through an SiOB device. The signal is at least partially reflected or absorbed such that only a portion of the signal propagates beyond the point of contact with the optical interrupter. Since SiOB processing is typically incompatible with MEMS device processing, the MEMS and SiOB devices are formed on separate supports and then attached, such as via flip-chip bonding methods.

Claims

1. An article comprising:

a micro-electromechanical systems chip comprising a first substrate having a micro-electromechanical device and a first plurality of bonding sites disposed on a first surface thereof; and

an optical bench chip comprising a second substrate having an optical device and a second plurality of bonding sites disposed on a first surface thereof;

wherein,

the first and second substrates are attached at the respective first and second pluralities of bonding sites such that the first surfaces of each substrate are in opposed and spaced relation to one another, and further wherein the micro-electromechanical device and the optical device communicate with one another either mechanically or electromagnetically.

2. The article of claim 1, wherein the micro-electromechanical device is operable to move with applied electrical energy.

3. The article of claim 2, wherein the micro-electromechanical device comprises an actuator.

4. The article of claim 3, wherein the micro-electromechanical device further comprises an optical interruptor and a linkage, wherein the linkage mechanically connects the optical interruptor to the actuator, and the actuator is operable to move the optical interrupter between a first position and a second position.

5. The article of claim 4, wherein the optical device comprises first and second optically communicating and spaced waveguides.

6. The article of claim 5, wherein in the first position, the optical interrupter is not within the space between the waveguides, and, in the second position, the optical interruptor is within the space between the waveguides such that the optical interrupter is operative to block a least a portion of an optical signal traveling between the first and second waveguides.

7. The article of claim 3, wherein the actuator comprises:

a nonmoving conductive surface; and

a movable conductive plate supported over the nonmoving surface by a plate support having a flexible member that allows the movable plate to move in an out-of-plane direction relative to the nonmoving surface;

wherein,

the nonmoving surface and movable plate are suitably spaced to support an electrostatic charge therebetween operable to cause the movable plate to move towards the nonmoving plate upon application of a voltage.

8. The article of claim 4, wherein the actuator comprises:

a nonmoving conductive surface; and

a movable conductive plate supported over the nonmoving surface by a plate support having a flexible member that allows the movable plate to move in an out-of-plane direction relative to the nonmoving surface;

wherein,

the nonmoving surface and movable plate are suitably spaced to support an electrostatic charge therebetween operable to cause the movable plate to move towards the nonmoving plate upon application of a voltage, which movement causes the linkage to move and, in turn, moves the optical interrupter between the first and second positions.

9. The article of claim 1, wherein the second substrate comprises silicon.

10. A method for making a micro-optical electromechanical device, comprising the steps of:

forming a micro-electromechanical device and first plurality of bonding sites on a first support;

forming an optical device and second plurality of bonding sites on a second support;

aligning the first plurality of bonding sites with the second plurality of bonding sites; and

bonding the first plurality of bonding sites to the second plurality of bonding sites.

11. The method of claim 10, wherein forming the first and second plurality of bonding sites further comprises forming conductive contacts.

12. The method of claim 10, wherein the step of bonding further comprises flip-chip bonding.

13. The method of claim 12, further comprising the step of removing the first support.