Multilayer integrated assembly having specialized intermediary substrate

• US 5,997,708 A
• Filed: 04/30/1997
• Issued: 12/07/1999
• Est. Priority Date: 04/30/1997
• Status: Expired due to Term

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Craig, Stephen R.
• Primary Examiner(s): Warden, Robert
• Assistant Examiner(s): Snider, Theresa T.
• Application Number:
  US08/846,607
• Time in Patent Office: 951 Days
• Field of Search: 204/600, 204/601, 73/23.22, 73/23.39, 73/61.52, 73/61.53, 422/70, 422/89, 210/198.2, 210/656, 96/101, 95/82, 435/288.5
• US Class Current: 204/601
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0883 Serpentine channels
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2400/0415 electrical forces, e.g. electrokinetic
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/5055 Hinged, e.g. opposable surfaces
• CPC Class Codes: G01N 30/6095 Micromachined or nanomachined, e.g. micro- or nanosize

Abstract

A multilayer integrated assembly for effecting fluid handling functions includes complementary microstructures formed by an etching or similar process in a planar foldable substrate. The complementary microstructures may be superimposed in a controlled manner by operation of micro-alignment means also formed in the foldable substrate by an etching or similar process. Microstructures are contemplated as including channels (that may be superimposed to form fluid conduits), apertures, conduit apertures, sample processing compartments, and the like. An intermediary substrate may optionally be incorporated in the integrated assembly so as to provide a material having a thickness or composition that may differ in a useful characteristic from the material used to provide the foldable substrate and accordingly expand the functionality of the integrated assembly. The intermediary substrate may offer a surface treatment, structure, or function that is difficult or impractical to provide in the foldable substrate but which can be effectively provided in the material used to fabricated the intermediary substrate. The resulting integrated assembly may be bonded and subsequently operated to implement one or more fluid-handling functions.

Claims

1. A multilayer integrated assembly for effecting fluid handling functions for use in a sample analysis system, comprising:

a planar foldable substrate having a linear fold means, the linear fold means defining a linear fold axis and first and second component sections, wherein said first and second component sections include respective first and second surface features on respective first and second mating surfaces,

an intermediary substrate having at least an intermediary surface feature on a selected one of third and fourth mating surfaces, said intermediary substrate being interposed between the first and second component sections so as to abut the first mating surface at the third mating surface and the second mating surface at the fourth mating surface when the intermediary substrate is retained in the integrated assembly;

wherein a selected one of the first and second surface features and the intermediary surface feature are aligned and superimposed by folding the substrate at the linear fold axis to form a fluid handling functional device in a unitary planar assembly.

2. The integrated assembly of claim 1, further comprising n component sections and (n-1) linear fold means, wherein n equals three or more, and wherein the component sections are closed upon one another in a Z-fold configuration.

3. The integrated assembly of claim 1, wherein the first, second, third, and fourth mating surfaces are susceptible to diffusion bonding at a desired diffusion bonding temperature.

4. The integrated assembly of claim 3, wherein the surface feature further includes a surface defect and further comprising a surface layer in at least one of the first, second, third, and fourth mating surfaces formulated to melt at the desired diffusion bonding temperature, thus forming an amount of transient liquid phase, whereby the amount of the transient liquid phase fills the surface defect.

5. The integrated assembly of claim 4, wherein the surface defect is located at the interface of a selected one of the first, second, and intermediary surface features.

6. The integrated assembly of claim 5, wherein the first and second surface features further comprise complementary microstructures.

7. The integrated assembly of claim 5, wherein the first and second surface features further comprise complementary microstructures and further comprising means for inhibiting flow of the transient liquid phase into the fluid handling functional device.

8. The integrated assembly of claim 1, wherein the linear fold means includes a fold relief for relieving stress or deformation induced in the substrate in the immediate area of the fold axis during operation of the linear fold means.

9. The integrated assembly of claim 1, further comprising corroboration means for corroborating the alignment of a selected pair of the first, second, and intermediary surface features.

10. The integrated assembly of claim 1, wherein the intermediary surface feature further comprises a surface feature selected from the group consisting of:

complementary microstructure, conductor, semiconductor, insulator, electrode, sensor, sensor array, catalyst, orifice, screen, well, restriction, frit, perforation, porous section, permeable region, and semi-permeable region.

11. The integrated assembly of claim 1, wherein the intermediary surface feature further comprises a surface treatment on a particular portion of the surface of the intermediary substrate wherein the surface treatment is selected from the group consisting of:

a chemically-active region, biologically-active region, optical, electrical, opto-electrical, magneto-optical, or magnetic characteristic.