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Method of extracting heat from a semiconductor body and forming microchannels therein

  • US 5,998,240 A
  • Filed: 05/04/1998
  • Issued: 12/07/1999
  • Est. Priority Date: 07/22/1996
  • Status: Expired due to Fees
First Claim
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1. A method of extracting heat from a solid-state device comprising the steps of:

  • forming a plurality of microchannel grooves having a relatively thin layer of electrically conductive material on all surfaces thereof, in one region of a semiconductor body comprising a die of silicon or silicon carbide and including a plurality of active semiconductor devices formed in another region of the same said semiconductor body, said grooves being in parallel alignment with said plurality of active semiconductor devices and having a width ranging between about 0.001 in. and about 0.004 in., a depth ranging between about 0.004 in. and about 0.01 in. and having a spacing therebetween ranging between about 0.001 in. and about 0.003 in.;

    coupling a source of fluid coolant to and from said microchannel grooves; and

    ,effecting a flow of said coolant through said microchannel grooves to extract, by forced convection, heat generated by said active semiconductor devices.

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