Microcircuit with memory that is protected by both hardware and software
First Claim
1. A secured data module apparatus comprising:
- a housing with a cavity formed from a first conductive surface and a second conductive surface with an insulator disposed therebetween in an area where a portion of said first conductive surface and a portion of said second conductive surface overlap such that said insulator is disposed between overlapping side portions of said firs and second conductive surfaces, so as to insulate said first and second conductive surfaces from each other;
a substrate with a top surface and a bottom surface disposed in said cavity;
a semiconductor chip comprising a monolithic integrated circuit, said semiconductor chip having a passivated side and a bulk side, wherein said passivated side is affixed to said top surface of said substrate; and
affixing means for affixing said passivated side of said semiconductor chip to said top surface of said substrate.
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Accused Products
Abstract
A secure electronic data module containing a monolithic semiconductor chip of the type having a memory that is protected by a combination of hardware and software mechanisms such that unauthorized access to the data stored in the memory is prevented. The monolithic semiconductor chip comprises a plurality of solder bumps for attaching the chip to a substrate that may be a printed circuit board or another chip; a multi-level interlaced power and ground lines using minimum geometries; and a detection circuit block for detecting an external trip signal that may be produced by a pre-specified change in an operating condition brought on by unauthorized accessing, or an internal trip signal that may be produced by shorting of power and ground lines or by a change in an oscillator'"'"'s frequency, also associated with or appurtenant to unauthorized accessing of the secure memory.
138 Citations
27 Claims
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1. A secured data module apparatus comprising:
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a housing with a cavity formed from a first conductive surface and a second conductive surface with an insulator disposed therebetween in an area where a portion of said first conductive surface and a portion of said second conductive surface overlap such that said insulator is disposed between overlapping side portions of said firs and second conductive surfaces, so as to insulate said first and second conductive surfaces from each other; a substrate with a top surface and a bottom surface disposed in said cavity; a semiconductor chip comprising a monolithic integrated circuit, said semiconductor chip having a passivated side and a bulk side, wherein said passivated side is affixed to said top surface of said substrate; and affixing means for affixing said passivated side of said semiconductor chip to said top surface of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An electronic data carrier system, comprising:
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a housing formed from two concave electrically conductive surfaces and an insulating member disposed therebetween in an area where said concave conductive surfaces overlap such that said insulator is disposed between overlapping side portions of said firs and second conductive surfaces, so as to insulate said first and second conductive surfaces from each other, said housing defining a cavity; a substrate disposed in said cavity, said substrate comprising a top surface and a bottom surface; a semiconductor chip comprising circuitry for at least storing an encryption key; and a plurality of solder bumps for affixing said semiconductor chip to said substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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Specification