Air-packed CCD images package and a mold for manufacturing thereof

• US 5,998,862 A
• Filed: 09/05/1995
• Issued: 12/07/1999
• Est. Priority Date: 03/26/1993
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Yamanaka, Hideo
• Primary Examiner(s): Munson, Gene M.
• Application Number:
  US08/526,145
• Time in Patent Office: 1,554 Days
• Field of Search: 257/704, 257/678, 257/680, 257/753, 257/666, 257/797, 257/787, 257/433, 257/434
• US Class Current: 257/704
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A plastic lid having a cavity portion is put to cover a pedestal from its front-surface side to its side-surface side, the pedestal having a semiconductor chip mounted thereon. An adhesive agent is charged into a space between the plastic lid and the pedestal so as to bond the plastic lid with the pedestal. Accordingly, a window frame is not necessary, corona discharge treatment or the like is not necessary, and it is therefore not necessary to use a B-stage thermosetting adhesive agent to thereby reduce the manufacturing cost of a semiconductor device of a hollow package structure having such a plastic lid. If a UV radiation setting adhesive agent or a visible radiation setting adhesive agent is used as the adhesive agent, cure time in bonding can be reduced.

Claims

1. A CCD semiconductor device comprising:

a pedestal having a CCD semiconductor chip mounted on a top surface of said pedestal;

leads with portions thereof disposed on said top surface of said pedestal, said portions being connected to said CCD semiconductor electrically; and

a plastic lid having a transparent central portion, a side wall substantially perpendicular to a plane of the transparent central portion, the side wall having at least a first indentation presenting an edge surface substantially parallel to the plane of the transparent central portion wherein the indentation in the side wall is located between the transparent central portion and an end of the side wall opposite the transparent central portion and the edge surface is adjacent the leads and the pedestal.

2. A semiconductor device according to claim 1, further comprising a second indentation in the side wall of the plastic lid presenting a second edge surface substantially parallel to the plane of the transparent central portion, thereby providing a gap between the pedestal and the lid, wherein resin fills the gap.

3. A CCD semiconductor device according to claim 2, in which the first indentation which is bonded with said pedestal and said leads is located at a level higher than a surface of said semiconductor chip.

4. A CCD semiconductor device according to claim 1, in which a portion of said plastic lid which is bonded with said pedestal and said lead frames with a adhesive agent is sealed with a sealing member.

5. A CCD semiconductor device according to claim 1, in which an optical filter is formed in the transparent central portion of said plastic lid.

6. A CCD semiconductor device comprising:

a pedestal and a semiconductor chip bonded respectively on opposite surfaces of a pressure sensitive adhesive double-coated tape;

a tape of a TAB system bonded onto the surface of said pressure sensitive adhesive double coated tape on which said semiconductor chip is bonded, said TAB system tape having an inner lead connected to a pad portion of said semiconductor chip; and

a plastic lid having a transparent central portion, a side wall substantially perpendicular to a plane of the transparent central portion, the side wall having at least at first indentation presenting an edge surface substantially parallel to the plane of the transparent central portion, the edge of said plastic lid being bonded to said pedestal with an adhesive agent.

7. A CCD semiconductor device according to claim 6, in which the edge of said plastic lid which is bonded with said pedestal is located at a level lower than a bonding surface of said semiconductor chip.

8. A CCD semiconductor device according to claim 6, in which an outer lead portion of said tab system tape extends out from said semiconductor device.

9. A CCD semiconductor device comprising:

a pedestal;

a chip mounted on a top surface of the pedestal;

a plurality of leads having inner portions on a top surface of said pedestal, said leads extending down a side surface of the pedestal;

a plastic lid having a transparent central portion located above the chip, said plastic lid having a side wall substantially perpendicular to a plane of the transparent central portion, said side wall having at least a first indentation presenting an edge having a surface substantially parallel to the top surface of the pedestal, said indentation and edge surface mounted adjacent the leads and a portion of the top surface of the pedestal, wherein the indentation is located between the transparent central portion and an end of the side wall.

10. The CCD semiconductor device of claim 9, further comprising a second indentation in the side wall presenting a second edge having a surface substantially parallel to the top surface of the pedestal, the second edge forming a gap between the pedestal and the lid.