Injection mold data transmission system

• US 6,000,831 A
• Filed: 02/12/1997
• Issued: 12/14/1999
• Est. Priority Date: 02/12/1997
• Status: Expired due to Term

• Current Assignee: Husky Injection Molding Systems Limited
• Original Assignee: American MSI Corp (Autodesk, Inc.)
• Inventors: Triplett, Timothy
• Primary Examiner(s): Elmore, Reba I.
• Assistant Examiner(s): NATNITHITHADHA, NAVIN
• Application Number:
  US08/798,831
• Time in Patent Office: 1,035 Days
• Field of Search: 364/475.01, 364/475.02, 364/475.05, 364/475.06, 364/475.07, 364/475.08, 364/475.09, 364/475.1, 264/40.1, 264/40.4, 264/40.5, 264/40.6, 264/328.1, 264/328.14, 264/328.4, 264/328.18, 425/135, 425/143, 425/144-146
• US Class Current: 700/204
• CPC Class Codes: B29C 2945/76006 Pressure
• CPC Class Codes: B29C 2945/7604 Temperature
• CPC Class Codes: B29C 2945/76254 Mould
• CPC Class Codes: B29C 2945/76531 Temperature
• CPC Class Codes: B29C 2945/76732 Mould
• CPC Class Codes: B29C 2945/76993 Remote, e.g. LAN, wireless LAN
• CPC Class Codes: B29C 33/0083 Electrical or fluid connection systems therefor
• CPC Class Codes: B29C 45/1774 Display units or mountings therefor; Switch cabinets
• CPC Class Codes: B29C 45/27 Sprue channels ; Runner channels or runner nozzles
• CPC Class Codes: B29C 45/76 Measuring, controlling or regulating measuring in general G01; controlling or regulating in general G05
• CPC Class Codes: B29C 45/78 of temperature

Abstract

The present invention relates to injection mold hot runner control devices and more particularly to an injection molding control device which eliminates the conventional control cables to improve the quality of feedback signals received by the controller and the safety of the environment in which such systems are used. The present invention utilizes a signal processor to convert analog signals received from the mold temperature sensors into a digital feedback signal in the vicinity of the mold and to transmit such feedback signal to a receiver connected to a controller at a location remote from the mold. The mold controller processes the feedback signal and generates a corresponding control signal. The control signal is transmitted from the remotely located controller to the controlled device, typically the mold heaters. A single controller and a single mold signal processor may be used to be able to control numerous molds by utilizing signals on different lines or frequencies or in other means of signal differentiation known to those skilled in the art. The system of the present invention enables the injection mold user to eliminate the numerous problems, difficulties and repair costs of the prior art as well as enabling the user to gain an improved feedback loop that was not feasible under control systems of the prior art.

Claims

1. An injection mold information transmitter apparatus, comprising:

a) an injection mold;

b) at least one sensor providing information from said injection mold;

c) a thermally isolated enclosure;

d) sensor input circuitry positioned within said thermally isolated enclosure and coupled to said injection mold sensor;

e) an analog to digital signal converter located within said thermally isolated enclosure; and

f) a controller located at a location remote from said thermally isolated enclosure, said controller arranged to receive digital signals from said converter based on the information from said sensors.

2. An injection mold transmitter apparatus as set forth in claim 1 wherein said apparatus further includes a wireless transmitter that communicates digital signals from said analog to digital signal converter to said controller.

3. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a junction box which communicates with the apparatus for operating said injection mold and one or more of the components in said thermally isolated enclosure.

4. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a sensor conditioning input circuit.

5. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes an isolation circuit.

6. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a multiplexer.

7. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes an amplifier.

8. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a microprocessor.

9. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a transmitter in said thermally isolated enclosure and arranged to transmit a digital signal from said converter to said controller.

10. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a power supply.

11. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a sensor signal amplifier for low level analog signals.

12. An injection mold transmitter apparatus as set forth in claim 2 wherein said apparatus further includes a sensor conditioning input circuit, an isolation circuit which directly or indirectly communicates with said conditioning input circuit, a multiplexer which directly or indirectly communicates with said isolation circuit, an amplifier which directly or indirectly communicates with said multiplexer, said analog to digital converter which directly or indirectly communicates with said amplifier, a microprocessor which directly or indirectly communicates with said analog to digital converter, and a wireless transmitter which directly or indirectly communicates with said microprocessor.

13. A method of injection mold information transmission, comprising:

1) communicating data between an injection mold sensor and an analog to digital signal converter;

2) positioning said analog to digital signal converter within a thermally isolated enclosure;

3) communicating data between said analog to digital signal converter and said controller; and

4) positioning said controller at a location remote from said thermally isolated enclosure.

14. An injection mold transmitter apparatus, comprising:

1) means for generating at last one reporting signal;

2) at least one controlled device associated with the injection mold; and

,

3) a signal processor arranged within a thermally isolated enclosure to process said reporting signals for use by a remotely located mold controller, said signal processor being connected to a first transmitter, and means to transmit said reporting signals to said remotely located controller.

15. An injection mold transmitter apparatus as set forth in claim 14 wherein said apparatus further includes means for the wireless transmission of a digital signal from said signal processor to said converter.

16. A method of injection mold control, comprising:

1) connecting a means for generating at least one reporting analog signal from a mold sensor;

2) means for converting said analog signal to digital form within a thermally isolated enclosure coupled to the injection mold; and

3) means for transmitting said digital signal to a remotely located mold control device.

17. An injection mold control system, comprising:

1) a mold sensor;

2) an analog signal generator coupled to said mold sensor that generates reporting signals in analog form;

3) a thermally isolated enclosure coupled to the injection mold within which is positioned a signal processor that converts said reporting signals to digital form; and

4) a transmitter to transmit said digital signals to a remotely located control device by wireless means.