Method of producing a tag device with IC capacitively coupled to antenna

• US 6,001,211 A
• Filed: 04/21/1998
• Issued: 12/14/1999
• Est. Priority Date: 07/18/1995
• Status: Expired due to Fees

• Current Assignee: OKI Electric Industry Company Limited
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Hiroyuki, Noto
• Primary Examiner(s): MAYES, MELVIN C
• Application Number:
  US09/062,900
• Time in Patent Office: 602 Days
• Field of Search: 156/277, 156/300, 156/278, 156/292, 235/491, 235/492, 235/451
• US Class Current: 156/277
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: Y10T 156/1093 with covering of discrete laminae with additional lamina

Abstract

A tag device and a method of producing it are disclosed. The tag device has an IC (Integrated Circuit) device, electrode plates included in the IC device, an electrically insulating film covering the electrode plates, antenna terminals each facing one of the electrode plates with the intermediary of an electrically insulating film, antennas each being connected to one of the antenna terminals, and packings. The tag device is highly durable and reliable and can be produced by a simple procedure.

Claims

1. A method of producing a tag device, comprising the steps of:

forming a generally flat antenna terminal on a first packing;

preparing an IC device including a response circuit for storing information and for outputting a signal based on said information, a generally flat electrode plate, and an electrically insulating film covering said electrode plate;

placing said IC device on said antenna terminal such that said antenna terminal and said electrode plate face each other;

placing a second packing on said IC device, and adhering said first packing and said second packing.

2. A method of producing a tag device, comprising the steps of:

forming a generally flat antenna terminal on a first packing;

forming a dielectric layer on said antenna terminal;

preparing an IC device including a response circuit for storing information and for outputting a signal based on said information, a generally flat electrode plate, and an electrically insulating film covering said electrode plate;

placing said IC device on said dielectric layer such that said antenna terminal and said electrode plate face each other; and

placing a second packing on said IC device, and adhering said first packing and said second packing.

3. A method of producing a tag device, comprising the steps of:

preparing an IC device including a response circuit for storing information and for outputting a signal based on said information, a generally flat electrode plate, and an electrically insulating film covering said electrode plate;

placing said IC device on a first packing with said electrode plate facing upward;

forming a generally flat antenna terminal on said IC device such that said antenna terminal faces said electrode plate; and

placing a second packing on said antenna terminal, and adhering said first packing and said second packing around said IC device.

4. A method of producing a tag device, comprising the steps of:

preparing an IC device including a response circuit for storing information and for outputting a signal based on said information, a generally flat electrode plate, and an electrically insulating film covering said electrode plate;

placing said IC device on a first packing with said electrode plate facing upward;

forming a dielectric layer on said electrode plate;

forming a generally flat antenna terminal on said dielectric layer such that said antenna terminal faces said electrode plate; and

placing a second packing on said antenna terminal, and adhering said first packing and said second packing around said IC device.

5. A method of producing a tag device, comprising the steps of:

forming a first generally flat antenna terminal on a first packing;

preparing an IC device including a first generally flat electrode plate provided on one of opposite major surfaces of a semiconductor substrate, a second generally flat electrode plate provided on the other major surface of said semiconductor substrate, an electrically insulating film covering said first electrode plate and said second electrode plate, and a response circuit for storing information and for outputting a signal based on said information;

placing said IC device on said first antenna terminal such that said first antenna terminal and said first electrode plate face each other;

forming a second generally flat antenna terminal on said IC device such that said second antenna terminal faces said second electrode plate; and

placing a second packing on said second antenna terminal, and adhering said first packing and said packing around said IC device.

6. A method of producing a tag device, comprising the steps of:

forming a first generally flat antenna terminal on a first packing;

forming a first dielectric layer on said first antenna terminal;

preparing an IC device including a first generally flat electrode plate provided on one of opposite major surfaces of a semiconductor substrate, a second generally flat electrode plate provided on the other major surface of said semiconductor substrate, an electrically insulating film covering said first electrode plate and said second electrode plate, and a response circuit for storing information and for outputting a signal based on said information;

placing said IC device on said first dielectric layer such that said first antenna terminal and said first electrode plate face each other;

forming a second dielectric layer on said IC device;

forming a second generally flat antenna terminal on said second dielectric layer such that said second antenna terminal faces said second electrode plate; and

placing a second packing on said second antenna terminal, and adhering said first packing and said second packing around said IC device.