Method for transfer molding encapsulation of a semiconductor die with attached heat sink

• US 6,001,672 A
• Filed: 02/25/1997
• Issued: 12/14/1999
• Est. Priority Date: 02/25/1997
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Wensel, Richard W.
• Primary Examiner(s): GRAYBILL, DAVID E
• Application Number:
  US08/804,911
• Time in Patent Office: 1,022 Days
• Field of Search: 438/124, 438/FOR 413, 264/272.17
• US Class Current: 438/124
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

A process for manufacturing semiconductor device including a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsulant packaging compound material from flowing onto the heat sink. The dam may be a gasket. The dam may also be a burr created by, for example, stamping the bottom of the heat sink. The dam may include copper, polyamides, and leadlock tape. The dam may be permanently connected to the heat sink or removed following packaging. The dam may be removed mechanically, through the use of heat, or during an electrolytic deflash cycle.

Claims

1. A method of packaging a semiconductor device assembly, comprising:

forming a heat sink having a top surface and a bottom surface, each top and bottom surface having peripheral edges therearound and central portions thereof;

forming a protrusion at the peripheral edges of the bottom surface of the heat sink away from the central portion of the bottom surface of the heat sink;

positioning the top surface of the heat sink adjacent to a semiconductor device having a plurality of bond pads thereon; and

placing the heat sink and semiconductor device in a transfer molding apparatus with the protrusion formed at the peripheral edges of the bottom surface of the heat sink in contact with a portion of the transfer molding apparatus.

2. The method of claim 1, further including the steps of:

providing a lead frame; and

connecting at least one bond pad to the leadframe.

3. The method of claim 1, further including the step of:

removing the protrusion.

4. The method of claim 3, wherein the protrusion is removed with heat.

5. The method of claim 3, wherein the protrusion is removed during an electrolytic deflash cycle.

6. A method of packaging a semiconductor device assembly, comprising:

positioning a dam adjacent to surface of a heat sink away from a central portion of the surface of the sink;

positioning the heat sink adjacent to a semiconductor device; and

positioning the dam, heat sink, and semiconductor device in a transfer molding apparatus with the dam contacting a portion of transfer molding apparatus.

7. The method of claim 6, wherein the dam includes a gasket.

8. The method of claim 6, wherein the dam is connected to the heat sink.

9. The method of claim 6, further including the step of:

encapsulating the semiconductor device and heat sink in molding material in the transfer molding apparatus.

10. The method of claim 9, further including the step of:

removing the dam from adjacent the heat sink following the encapsulation of the semiconductor device and the heat sink in molding material in the transfer molding apparatus.

11. A method of packaging a semiconductor device assembly, comprising:

providing a lead frame;

positioning a dam adjacent to a surface of a heat sink, with edges of the dam positioned proximate peripheral edges of the surface and the dam positioned away from a central portion of the surface;

positioning the heat sink adjacent to a semiconductor device; and

positioning the lead frame, semiconductor device, heat sink, and dam in a transfer molding apparatus, the dam contacting a portion of the transfer molding apparatus.

12. The method of claim 11, wherein the dam includes a gasket.

13. The method of claim 11, wherein the dam is connected to the heat sink.

14. The method of claim 11, further including the step of:

encapsulating a portion of the lead frame, semiconductor device, and heat sink in molding material in the transfer molding apparatus.

15. The method of claim 14, further including the step of:

removing the dam from adjacent the heat sink following the encapsulation of the semiconductor device and the heat sink in molding material in the transfer molding apparatus.