Power semiconductor packaging

• US 6,002,183 A
• Filed: 05/04/1995
• Issued: 12/14/1999
• Est. Priority Date: 05/04/1995
• Status: Expired due to Fees

• Current Assignee: Arthur H. Iversen, George Gabor
• Original Assignee: Arthur H. Iversen, George Gabor
• Inventors: Iversen, Arthur H., Gabor, George
• Primary Examiner(s): Shoop, Jr., William M.
• Assistant Examiner(s): PALADINI, ALBERT WILLIAM
• Application Number:
  US08/435,782
• Time in Patent Office: 1,685 Days
• Field of Search: 307/131, 307/150, 307/147, 327/564, 327/565, 257/713, 257/691, 257/724
• US Class Current: 307/147
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/112 Mixed assemblies
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/13034 : Silicon Controlled Rectifier [SCR]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

Power output switching circuit for use in high current and high frequency applications. The output circuit provides a series of geometrically symmetric, parallel spaced semiconductor converters arranged such that the voltage for each semiconductor output device is substantially equal and minimal for each device. In this way, each device exhibits substantially the same impedance, such that circuit performance is largely a function of intrinsic device characteristics, and substantially independent of cross coupling and other external influences.

Claims

1. A power control unit comprising first and second power connection, and at least one cluster, said cluster comprising;

first and second cluster power terminals;

first and second cluster control terminals;

a plurality of semiconductor devices mounted on a conductive substrate, each of said semiconductor devices having first and second power ports defining a controlled current path therebetween, and first and second control ports defining a control path for controlling the current flow through said controlled current path;

an electrically conductive first interconnect having respective opposing ends, said first cluster power terminal and said first juncture located at said respective ends of said first interconnect;

an electrically conductive second interconnect having respective opposing ends, said second cluster power terminal and said second juncture located at said respective ends of said second interconnect;

said first interconnect connected, at said first juncture, to said conductive substrate;

said plurality of devices disposed relative to said first interconnect such that current flow paths between said first cluster power terminal and said first power ports of each of said plurality of devices are each of substantially equal impedance;

a second power port interconnect connecting said second interconnect to said second power port of each of said plurality of devices and connected, at a predetermined second juncture, to said second interconnect; and

said plurality of devices disposed relative to said second interconnect such that current flow paths between said device second power ports and said second cluster power terminal are each of substantially equal impedance.

2. The power control unit of claim 1 wherein:

said first control ports of each of said plurality of devices are electrically connected to said first cluster control terminal such that said current paths between said first cluster control terminal and said first control port of each of said plurality of devices are of substantially equal impedance; and

said second control ports of each of said plurality of devices are electrically connected to said second cluster control terminal such that said current paths between said second cluster control terminal and said second control port of each of said plurality of devices are of substantially equal impedance.

3. The power control unit of claim 1 wherein:

the impedance of said current flow paths between said first cluster power terminal and said first power ports of said devices is minimized; and

the impedance of said current flow paths between said second cluster power terminal and said second power ports of said devices is minimized.

4. The power control unit of claim 2 wherein:

the impedance of said current flow paths between said first cluster power terminal and said first power ports of said devices is minimized;

the impedance of said current flow paths between said second cluster power terminal and said second power ports of said devices is minimized;

said first control ports of each of said plurality of devices are electrically connected to said first cluster control terminal such that said current paths between said first cluster control terminal and said first control port of each of said plurality of devices are of substantially minimal impedance; and

said second control ports of each of said plurality of devices are electrically connected to said second cluster control terminal such that said current paths between said second cluster control terminal and said second control port of each of said plurality of devices are of substantially minimal impedance.

5. The power control unit of claim 4 wherein said cluster further comprises:

an electrically and thermally conductive substrate having a first surface to which a power port of each of said plurality of devices is electrically and thermally connected in predetermined relative disposition, said substrate operating as a heat sink for said plurality of devices, said substrate being electrically connected to at least one of said interconnects.

6. The power control unit of claim 5 wherein said device power ports comprise conductive elements such that said control path includes a portion of said controlled current path and said electrical connection to said second cluster control terminal is disposed to minimize the impedance of said portion of said controlled current path included in said control path.

7. The power control unit of claim 4 wherein said second control port of each of said plurality of devices comprises one of said power ports of said device.

8. The power control unit of claim 4 further comprising a plurality of semiconductor device clusters.

9. The power control unit of claim 8 wherein:

said unit further comprises first power control unit interconnects electrically connecting said first cluster power terminal of each cluster to said power control unit first power connection, such that the impedance of each of said current flow paths between said first control port of each device to said power control unit first power connection is substantially identical;

second power control unit interconnects electrically connecting said second cluster power terminal of each cluster to said power control unit second power connection, such that the impedance of each of said current flow paths between said second power port of each device to said power control unit second power connection is substantially identical;

said first cluster control terminal of each of said clusters electrically isolated from said first cluster control terminal of said other clusters; and

said second cluster control terminal of each of said clusters is electrically isolated from said second cluster control terminal of said other clusters.

10. The power control unit of claim 9 wherein said power control units are connected in series between said unit power connections.

11. The power control unit of claim 9 including a plurality of electrically paralleled groups of series connected power control units wherein:

each said group of series connected power control units comprises a first power output driver connection member electrically connecting said first power connection of a series connected power control unit to said power output driver first power output driver connection, such that the impedance of each of said current flow paths between said first power port of each device to said power output driver first power output driver connection is substantially identical;

each said group of series connected power control units comprises a second power output driver connection member electrically connecting said second power connection of a series connected power control unit to said power output driver second power output driver connection, such that the impedance of each of said current flow paths between said second power port of each device to said power output driver second power output driver connection is substantially identical.

12. The power control unit of claim 4 wherein:

a cluster driver, an isolator and isolated power supply are incorporated to provide the control signal to devices.

13. The power control unit of claim 12 wherein:

said cluster driver is at least one of passive and active function.

14. The power control unit of claim 4 wherein:

said power control unit comprises at least one cluster having a first power connection, a first power control unit interconnect, a first cluster power terminal, a first interconnect, a first juncture, a conductive substrate, a first power port interconnect, and a first power port, and a second power port, a second power port interconnect, a second juncture, a second interconnect, a second cluster power terminal, a second power control unit interconnect, and a second power connection; and

at least one of said first power connection, first power control unit interconnect, a first cluster power terminal, a first juncture, a first interconnect conductive substrate, first power port interconnect and a first power port combine with the remainder in such a manner that at least two connections merge into at least one of a point, a line and a curve, becoming a single connection.

15. The power control unit of claim 4 wherein:

said power control unit comprises at least one cluster having a first power connection, a first power control unit interconnect, a first cluster power terminal, a first interconnect, a first juncture, conductive substrate, first power port interconnect, and a first power port, and a second power port, a second power port interconnect, a second juncture, a second interconnect, a second cluster power terminal, a second power control unit interconnect, and a second power connection; and

at least one of said second power connection, second power control unit interconnect, second cluster power terminal, second interconnect, second juncture, second power port interconnect, and second power port combine with the remainder in such a manner that at least two connections merge into at least one of a point, a line and a curve, becoming a single connection.

16. The power control unit of claim 4 wherein the current flow through a first power connection, then through a first cluster power terminal and then through a first power port, comprising a first current path;

the current then flowing through a second power port which then flows through a second cluster power terminal and then through a second power connection thereby comprising a second current path;

the current flow in said first and second current paths is parallel to and substantially concentric to a line which defines the center axis of an enclosing concentric conductive current return member;

the first power connection and the corresponding terminus of said member comprise the first terminus of the power output driver connection;

the second power connection and the corresponding end of said member comprise the second terminus of the power output driver connection.

17. The power control unit of claim 4 wherein the current flow through a first power connection, then through a first cluster power terminal and then through a first power port, comprising a first current path;

the current then flowing through a second power port which then flows through a second cluster power terminal and then through a second power connection thereby comprising a second current path;

the current in said first and second current paths is substantially centered between and proximate to two co-planar conductive ground/neutral current return planes;

a first power connection and the terminus of the first power output driver connection member is connected to and through an input power source to said return current planes;

a second power connection and the terminus of the second power output driver connection member is connected to and through a load to said return current planes.

18. The power control unit of claim 4 wherein the current flow through a first power connection, then through a first cluster power terminal and then through a first cluster power terminal and then through a first power port, comprising a first current path;

the current then flowing through a second power port which then flows through a second cluster power terminal and then through a second power connection thereby comprising a second current path;

the current in said first and second current paths lying in at least one plane that is co-planar to and proximate to a conductive ground/neutral current return plane;

a first power connection and the terminus of the first power output driver connection member is connected to and through an input power source to said return current planes;

a second power connection and the terminus of the second power output driver connection member is connected to and through a load to said return current planes.

19. The power control unit of claim 4 wherein the current flow through a first power connection, then through a first cluster power terminal and then through a first power port, comprising a first current path;

the current then flowing through a second power port which then flows through a second cluster power terminal and then through a second power connection thereby comprising a second current path;

the current flow in the current carrying members comprising said first current path is substantially parallel to and in the opposite direction to the current flow in the current carry members of said second current path, said first and second current carrying members lying proximate to each other and having minimized impedance.

20. In the apparatus of claim 4 wherein the plurality of devices comprising at least one cluster, being disposed in a generally circular configuration, generally centered to at least one of a first and second cluster power terminal, wherein the current flow between said first and second cluster power terminals is radial, on average, with respect to a line joining the centers of said devices, the line being a polygon of a generally circular character.

21. The power control unit of claim 4 wherein:

said conductive substrate first surface includes a first edge, said plurality of devices comprising at least one cluster disposed on the conductive substrate first surface such that a nominal line joining the centers of said devices is substantially parallel to said edge; and

the current flow between a first cluster power terminal and a second cluster power terminal is substantially orthogonal, on average, to the line joining the center of said devices.

22. The power control unit of claim 4 wherein at least one of said interconnects comprises a conductive sheet tapered to an apex.

23. The power control unit of claim 22 wherein said tapered conductive sheet includes apertures to provide plural current paths to said apex of substantially equal impedance.

24. The apparatus of claim 4 further comprising at least one liquid cooled concave curved heat exchange surface, said heat exchange surface having extended surfaces lying substantially in the direction of coolant flow, said extended surfaces being composed of at least one of linear and curved geometries, and said extended surfaces having heights and spacings ranging from about 0.1 mm to 5 mm.