Methods for producing novel ceramic composites

• US 6,004,500 A
• Filed: 05/19/1998
• Issued: 12/21/1999
• Est. Priority Date: 03/25/1996
• Status: Expired due to Fees

• Current Assignee: Grove Hydrogen Cells LLC (Intellectual Ventures LLC)
• Original Assignee: Rutgers University
• Inventors: Bandyopadhyay, Amit, Panda, Rajesh K., Safari, Ahmad, Janas, Victor F., Danforth, Stephen C., Agarwala, Mukesh
• Primary Examiner(s): Fiorilla, Christopher A.
• Application Number:
  US09/081,308
• Time in Patent Office: 581 Days
• Field of Search: 264/610, 264/621, 264/642, 264/219, 264/250, 264/614, 264/125
• US Class Current: 264/610
• CPC Class Codes: B33Y 70/10 Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: H10N 30/852 Composite materials, e.g. having 1-3 or 2-2 type connectivity

Abstract

A process for making ceramic composites includes the steps of: a) forming a polymer composition into a three-dimensional mold; b) filling said three-dimensional mold with one or more ceramic containing compositions; c) heating said filled mold to dry and sinter the ceramic; d) removing at least a portion of said three-dimensional mold thereby forming voids; and e) filling the voids with a second composition which has a piezoelectric coefficient which is substantially different from the piezoelectric coefficient of said ceramic structure. Steps a through e yield a controlled, non-random piezoelectric ceramic composite having 2-3, 3-2 or 3--3 connectivity with respect to the sintered ceramic and the second composition throughout the composite.

Claims

1. A process for making a composite comprising the steps of:

a) forming a polymer composition into a three-dimensional mold;

b) filling said three-dimensional mold with at least one ceramic containing compositions, said at least one ceramic containing composition having a higher melting point than said polymer composition;

c) drying, gelling or curing said at least one ceramic containing composition in the mold to harden the at least one ceramic containing composition in the three-dimensional mold;

d) removing the three-dimensional mold from the hardened material thereby forming voids;

e) sintering the hardened material to provide a slntered ceramic structure; and

f) filling the voids with a second composition which has a piezoelectric coefficient which is substantially different from the piezoelectric coefficient of said ceramic structure;

wherein steps a-e yield a controlled, non-random piezoelectric ceramic composite having 2-3, 3-2 or 3-3 connectivity with respect to the sintered ceramic and the second composition throughout the composite.

2. The process of claim 1 wherein during step b, a base is formed with said ceramic containing composition.

3. The process of claim 1 wherein the polymer composition is selected from the group consisting of waxed based thermoplastic polymers, elastomers, thermoplastic polymers, laser curable polymers, ultra violet ray curable polymer, waxes, tackifiers or combinations thereof.

4. The process of claim 1 wherein the ceramic containing composition or compositions is selected from the group consisting of Pb(Zr,Ti)O₃, BaTiO₃, PbZrO₃, PbTiO₃, PbNb₂ O₆, (Pb,Ca)TiO₃, (Pb,Sm)TiO₃, Pb(NbO₂)₂ /PbTiO₃, (1-x)Pb(Mg_1/3 Nb_2/3)O₃ --xPbTiO₃, (1-x-y)Pb(Zn_1/3 Nb_2/3)O₃ --xPbTiO₃ --yBaTiO₃, and (1-x-y)Pb(Zn_1/3 Nb_2/3)O₃ --xBaTiO₃ --yPbTiO₃, xPZN-(1-x)PMN, xPMN-(1-x)PZT, xPZN-(1-x)PZT.

5. The process of claim 1 wherein at least one of the ceramic containing compositions is piezoelectric.

6. The process of claim 5 wherein two or more different ceramic containing compositions are used to fill said polymer mold.

7. The process of claim 1 wherein two or more different ceramic containing compositions are used to fill said polymer mold.

8. The process of claim 1 wherein the removal of said polymer mold is accomplished by heating or solvent etching.

9. The process of claim 1 wherein the composition used to fill the voids caused by the removal of the polymer mold is selected from the group consisting of epoxy, silicone rubber, poly(vinylidene flouride) and copolymers thereof, polyvinylchloride, polyvinylflouride, glass, or ceramic.

10. The process of claim 1 wherein the ceramic containing composition or compositions are substantially in the form of a gel.

11. The process of claim 1 wherein the ceramic containing composition or compositions are substantially in the form of a slurry.

12. The process of claim 1 wherein the removal of the three-dimensional mold occurs during said sintering.

13. A process for making a controlled, non-random piezoelectric ceramic composite having 2-3, 3-2 or 3-3 connectivity comprising the steps of:

a) forming a polymer composition into a three-dimensional mold;

b) filling said three-dimensional mold with at least one ceramic containing compositions, said at least one ceramic containing composition having a higher melting point than said polymer composition;

c) drying, gelling or curing said at least one ceramic containing composition in the mold to harden the at least one ceramic containing composition in the three-dimensional mold;

d) removing the three-dimensional mold from the hardened material thereby forming voids;

e) sintering the hardened material to provide a sintered ceramic structure; and

f) filling the voids with a second composition which has a piezoelectric coefficient which is substantially different from the piezoelectric coefficient of said ceramic structure.

14. The process of claim 13 wherein the removal of the three-dimensional mold occurs during said sintering.