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Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector

  • US 6,005,262 A
  • Filed: 01/27/1998
  • Issued: 12/21/1999
  • Est. Priority Date: 08/20/1997
  • Status: Expired due to Term
First Claim
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1. A flip-chip bonded VCSEL CMOS circuit for safeguarding a CMOS device from rearwardly emitted light, generated by a VCSEL associated with the circuit, said circuit comprising:

  • a substrate;

    a CMOS device formed on said substrate and having a major surface, said CMOS device including a plurality of transistors having gate terminals, and a bonding pad formed on said major surface;

    an associated VCSEL having an upper mirror remote from the bonding pad for transmitting forwardly emitted light, and a lower mirror proximate said bonding pad for passing rearwardly emitted light, said VCSEL being mounted to said bonding pad and in electrical communication with said CMOS; and

    means on one of said major surface and said substrate for preventing a substantial portion of rearwardly emitted light generated by said VCSEL from impinging on the gate terminals and interfering with current flow of said transistors.

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