Semiconductor device and its manufacturing method

• US 6,005,284 A
• Filed: 05/21/1997
• Issued: 12/21/1999
• Est. Priority Date: 05/23/1996
• Status: Expired due to Term

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Ammo, Hiroaki, Ejiri, Hirokazu, Miwa, Hiroyuki
• Primary Examiner(s): LOKE, STEVEN HO YIN
• Application Number:
  US08/861,404
• Time in Patent Office: 944 Days
• Field of Search: 257/588, 257/587, 257/557, 257/554, 257/555, 257/556, 257/518, 257/525, 257/539, 257/256, 257/272, 257/273, 257/532, 257/574, 257/575, 257/576, 257/370
• US Class Current: 257/588
• CPC Class Codes: H01L 21/8224 comprising a combination of vertical and lateral transistors
• CPC Class Codes: H01L 21/8226 comprising merged transistor logic or integrated injection logic
• CPC Class Codes: H01L 27/0233 Integrated injection logic structures [I2L]
• CPC Class Codes: H01L 27/0635 in combination with bipolar transistors and diodes, or resistors, or capacitors
• CPC Class Codes: H01L 27/0647 Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor

Abstract

A bipolar semiconductor device includes an npn transistor using a base outlet electrode in the form of a polycrystalline Si film and one or more other devices using an electrode in the form of a polycrystalline Si film supported on a common p-type Si substrate, the sheet resistance of the polycrystalline Si film forming the base outlet electrode of the npn transistor is decreased to two thirds of the sheet resistance of the polycrystalline Si film forming at least one electrode of at least one other device. The base outlet electrode can be made by first making the polycrystalline Si film on the entire surface of the substrate, then applying selective ion implantation of Si to a selective portion of the polycrystalline Si film for making the base outlet electrode to change it into an amorphous state, and then annealing the product to grow the polycrystalline Si film by solid-phase growth.

Claims

1. A semiconductor device comprising:

a common semiconductor substrate;

an npn transistor having a base outlet electrode formed of a first polycrystalline silicon film and at least one other device having at least one electrode formed of a second polycrystalline silicon film, wherein;

said first polycrystalline silicon film forming the base outlet electrode of said npn transistor has a sheet resistance not larger than two thirds of the sheet resistance of said second polycrystalline film forming said other device electrode.

2. The semiconductor device according to claim 1, wherein said sheet resistance of said first polycrystalline silicon film forming the base outlet electrode of said npn transistor is not larger than 200 Ω

/□

, and said sheet resistance of said second polycrystalline silicon film forming the electrode of said other device is not less than 300 Ω

/□

.

3. The semiconductor device according to claim 1, wherein said first polycrystalline silicon film forming the base outlet electrode of said npn transistor has a crystalline grain size not smaller than 90 nm, and said second polycrystalline silicon film forming the electrode of said other device has a crystalline grain size smaller than 70 nm.

4. The semiconductor device according to claim 1, wherein a crystalline grain size of said first polycrystalline silicon film forming the base outlet electrode of said npn transistor is in a range of from 90 to 500 nm, and a crystalline grain size of said second polycrystalline silicon film forming the electrode of said other device is in a range of from 20 to 70 nm.

5. The semiconductor device according to claim 1, wherein said other device is a pnp transistor, and said at least one electrode is an emitter outlet electrode of said pnp transistor.

6. The semiconductor device according to claim 1, wherein said other device is a lateral pnp transistor having an emitter outlet electrode and a collector outlet electrode that are formed of said second polycrystalline silicon film.

7. The semiconductor device according to claim 1, wherein said other device is a substrate pnp transistor, and said at least one electrode is an emitter outlet electrode of said substrate pnp transistor.

8. The semiconductor device according to claim 1, wherein said other device is a vertical pnp transistor, and said at least one electrode is an emitter outlet electrode of said vertical pnp transistor.

9. The semiconductor device according to claim 1, wherein said other device is a MIS capacitor, and said at least one electrode is a top electrode of said MIS capacitor.

10. The semiconductor device according to claim 1, wherein said semiconductor substrate supports thereon both said npn transistor and at least one device selected from the group consisting of a MIS capacitor, a lateral pnp transistor, a substrate pnp transistor and a vertical pnp transistor.

11. The semiconductor device according to claim 1, further comprising a MIS capacitor and a lateral pnp transistor as said at least one other device, said MIS capacitor having a top electrode as said at least one electrode, and said lateral pnp transistor having an emitter outlet electrode as said at least one electrode.

12. The semiconductor device according to claim 1, further comprising a MIS capacitor, a lateral pnp transistor and a substrate pnp transistor as said at least one other device, said MIS capacitor having a top electrode as said at least one electrode, said lateral pnp transistor having an emitter outlet electrode and a collector outlet electrode as said at least one electrode, and said substrate pnp transistor having an emitter outlet electrode as said at least one electrode.

13. The semiconductor device according to claim 1, further comprising a plurality of said npn transistors which form an integration injection logic device, and including a substrate pnp transistor as said other device, said substrate pnp transistor having an emitter outlet electrode as said at least one electrode.

14. The semiconductor device according to claim 1, further comprising a further pnp transistor, a p-channel JFET and a MIS capacitor on said semiconductor substrate, and wherein said at least one electrode is a top electrode of said MIS capacitor.