Programmable punch mechanism

• US 6,006,636 A
• Filed: 07/24/1997
• Issued: 12/28/1999
• Est. Priority Date: 07/24/1997
• Status: Expired due to Term

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Coneski, Anthony F., Baldwin, Michael R., Hall, Alan V.
• Primary Examiner(s): Peterson, Kenneth E.
• Assistant Examiner(s): Bae, Gyounghyun
• Application Number:
  US08/900,090
• Time in Patent Office: 887 Days
• Field of Search: 83/571, 83/575, 83/620, 83/627, 83/687, 83/691, 83/699.31, 83/13
• US Class Current: 83/13
• CPC Class Codes: B26F 1/04 with selectively-operable punches
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: Y10T 83/04 Processes
• CPC Class Codes: Y10T 83/8841 Tool driver movable relative to tool support
• CPC Class Codes: Y10T 83/943 Multiple punchings
• CPC Class Codes: Y10T 83/9483 Adjustable

Abstract

An apparatus for simultaneously punching multiple holes in a ceramic substrate comprises a plurality of vertically movable and individually solenoid-operable punch drives disposed on a frame and selectively movable up and down relative to the frame. A horizontal arm extends from each of the punch drives and a punch extends from each of the extending arms and is movable vertically by the extending arms. Each of the punches is operable individually and operable simultaneously with selected others of the punches to punch one or more holes in a substrate at the same time. There may be provided at least four of the punches wherein the punches are disposed horizontally adjacent to one another in at least a 2×1 or a 2×2 grid with a spacing between adjacent punches of less than 8 mm. There may also be provided a control system for selectively operating the punch drives, with the control system adaptable to minimize the number of simultaneous strokes of the punches needed to punch a required number of holes in a substrate.

Claims

1. An apparatus for simultaneously punching multiple holes in a ceramic substrate comprising:

a frame;

a plurality of vertically movable and individually operable punch drives, each having an associated punch, said punch drives disposed on said frame selectively movable up and down relative to said frame; and

a member extending from each of said punch drives and movable vertically by operation of the punch drives,

said associated punch extending from each of the extending members and movable vertically by said extending members, each of the punches being horizontally offset from and non-coaxially aligned with the associated vertical punch drive, each of said punches being operable individually and operable simultaneously with selected others of said punches to punch one or more holes in a substrate at the same time.

2. The apparatus of claim 1 wherein each of said punch drives comprises a mechanically operated solenoid.

3. The apparatus of claim 1 wherein said punches are disposed horizontally adjacent to one another.

4. The apparatus of claim 3 wherein said vertical punch drives are disposed horizontally outward of said punches.

5. The apparatus of claim 1 comprising at least two of said punches and wherein said punches are disposed horizontally adjacent to one another in at least a 2×

1 grid.

6. The apparatus of claim 5 wherein the vertical punch drives associated with said punches are disposed horizontally outward of the grid of said punches.

7. The apparatus of claim 1 wherein said punches are disposed horizontally adjacent to one another with a spacing between adjacent punches of approximately 1 mm to 8 mm.

8. The apparatus of claim 1 wherein said member extending from each of said punch drives comprises an arm extending horizontally from said punch drives, said arm having at an end away from the punch drive a cavity for receiving said punch.

9. The apparatus of claim 1 further including a control system for selectively operating said punch drives, said control system adaptable to minimize the number of simultaneous strokes of said punches needed to punch a required number of holes in a substrate.

10. An apparatus for simultaneously punching multiple holes in a ceramic substrate comprising:

a frame;

a plurality of vertically movable pushrods disposed on said frame;

an individually operable punch drive associated with each of said vertical pushrods for selectively moving said pushrods up and down, each pushrod having an associated punch; and

an arm extending horizontally from each of said pushrods and movable vertically by operation of the punch drives,

said punch extending from said arm and movable vertically by said arm, said punch being horizontally offset from the associated vertical pushrod, said punch being operable individually and operable simultaneously with selected others of the punches to punch one or more holes in a substrate at the same time.

11. The apparatus of claim 10 comprising at least two of said punches and wherein said punches are disposed horizontally adjacent to one another in at least a 2×

1 grid.

12. The apparatus of claim 11 wherein the vertical pushrods associated with said punches are disposed horizontally outward of the grid of said punches.

13. The apparatus of claim 10 wherein said punches are disposed horizontally adjacent to one another with a spacing between adjacent punches of approximately 1 mm to 8 mm.

14. The apparatus of claim 10 further including a control system for selectively operating said punch drives, said control system adaptable to minimize the number of simultaneous strokes of said punches needed to punch a required number of holes in a substrate.

15. An apparatus for punching holes in a ceramic substrate comprising:

a frame;

a substrate holder mounted on said frame capable of horizontal movement to position said ceramic substrate in a desired location;

said ceramic substrate disposed on said substrate holder, said ceramic substrate having a location where a hole is desired to be punched;

a vertically movable pushrod disposed on said frame and horizontally offset from the desired substrate hole location;

a magnetically operable solenoid drive associated with a vertical drive guide for selectively moving said pushrod up and down in individual strokes;

an arm extending horizontally from said pushrod and movable vertically by operation of the drive; and

a punch extending from said arm and movable vertically by said arm a stroke distance equal to the stroke distance of said pushrod, the punch being horizontally offset from said vertical pushrod and vertically aligned with said desired substrate hole location, said punch being operable to punch a hole in a substrate at said desired substrate hole location.

16. A method of simultaneously punching multiple holes in a ceramic substrate comprising the steps of:

a) providing a punch apparatus comprising a frame;

a plurality of vertically movable and individually operable punch drives disposed on said frame, each of said punch drives having an associated punch, said punch drives selectively movable up and down relative to said frame;

a member extending from each of said punch drives and movable vertically by operation of the punch drives; and

said punch extending from each of said extending members and movable vertically by said extending members, each of the punches being horizontally offset from the associated vertical punch drive;

b) positioning a substrate beneath said punches; and

c) individually and simultaneously operating a selected number of said punches to punch one or more holes in a substrate at the same time, each hole being punched at a position non-coaxially aligned with the vertical punch drive associated with the punch making said hole.

17. The method of claim 16 wherein said holes are disposed horizontally adjacent to one another in at a grid pattern.

18. The method of claim 16 wherein the vertical punch drives associated with said punches are disposed horizontally outward of the grid of said punches, and wherein said holes are disposed horizontally inward of said punch drives.

19. The method of claim 16 wherein said holes are disposed horizontally adjacent to one another with a spacing between adjacent holes of approximately 1 mm to 8 mm.

20. The method of claim 16 further including the step of controlling the operation of said punch drives to minimize the number of simultaneous strokes of said punches needed to punch a required number of holes in a substrate.

21. An apparatus for simultaneously punching multiple holes in a ceramic substrate comprising:

a frame;

a plurality of vertically movable and individually operable punch drives, each of said punch drives having an associated punch, said punch drives disposed on said frame selectively movable up and down relative to said frame; and

,

a member extending from each of said punch drives and movable vertically by operation of the punch drives;

said associated punch extending from each of the extending members and movable vertically by said extending members, each of the punches being horizontally offset from and non-coaxially aligned with the associated vertical punch drive, each of said punches being operable individually and operable simultaneously with selected others of said punches to punch one or more holes in a substrate at the same time; and

,

a control system for selectively operating said punch drives, said control system adaptable to minimize the number of simultaneous strokes of said punches needed to punch a required number of holes in a substrate.

22. An apparatus for simultaneously punching multiple holes in a ceramic substrate comprising:

a frame;

a plurality of vertically movable pushrods disposed on said frame;

an individually operable punch drive associated with each of said vertical pushrods for selectively moving said pushrods up and down, each pushrod having an associated punch; and

,

an arm extending horizontally from each of said pushrods and movable vertically by operation of the punch drives,

said punch extending from said arm and movable vertically by said arms, said punch being horizontally offset from the associated vertical pushrod, said punch being operable individually and operable simultaneously with selected others of the punches to punch one or more holes in a substrate at the same time; and

,

a control system for selectively operating said punch drives, said control system adaptable to minimize the number of simultaneous strokes of said punches needed to punch a required number of holes in a substrate.

23. A method of simultaneously punching multiple holes in a ceramic substrate comprising the steps of:

a) providing a punch apparatus comprising a frame;

a plurality of vertically movable and individually operable punch drives disposed on said frame, each punch drive having an associated punch, said punch drives selectively movable up and down relative to said frame;

a member extending from each of said punch drives and movable vertically by operation of the punch drives; and

said punch extending from each of said extending members and movable vertically by said extending members, each of the punches being horizontally offset from the associated vertical punch drive;

b) positioning a substrate beneath said punches;

c) individually and simultaneously operating a selected number of said punches to punch one or more holes in a substrate at the same time, each hole being punched at a position non-coaxially aligned with the vertical punch drive associated with the punch making said hole; and

,

d) controlling the operation of said punch drives to minimize the number of simultaneous strokes of said punches needed to punch a required number of holes in a substrate.