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Method for applying heat bondable lamina to a substrate

  • US 6,007,660 A
  • Filed: 12/18/1997
  • Issued: 12/28/1999
  • Est. Priority Date: 04/12/1996
  • Status: Expired due to Term
First Claim
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1. A process of making a plurality of laminated cards, comprising the steps of:

  • (a) providing a webless supply of heat bondable, transparent lamina from which a successive plurality of laminate sheets is cut, wherein said lamina has a current leading edge;

    (b) cutting through the line along a cutting line at a predetermined distance from a reference of the lamina to provide a first sheet of laminate, wherein said cutting provides the laminate sheet with a trailing edge at the cutting line and wherein said cutting provides the lamina supply with a successive leading edge at the cutting line, and wherein there is no wasted lamina between the trailing edge of the laminate sheet and the successive leading edge of the lamina;

    (c) bringing the laminate sheet and a first card together into registrable contact to substantially completely cover one face of the card;

    (d) heat bonding the laminate sheet to the first card; and

    (e) following steps (b), (c) and (d) a plurality of times to yield said plurality of laminated cards.

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