Tab tape and method for producing same

• US 6,007,668 A
• Filed: 11/24/1997
• Issued: 12/28/1999
• Est. Priority Date: 08/08/1992
• Status: Expired due to Term

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Koyanagi, Kazuo, Kodani, Kotaro, Sato, Kiyokazu
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): Bahta, Abraham
• Application Number:
  US08/976,614
• Time in Patent Office: 764 Days
• Field of Search: 428/457, 428/687, 428/209, 428/901, 428/138, 428/458, 428/601, 428/596, 428/626, 428/621, 428/622, 428/672, 428/674, 428/131, 428/615, 428/141, 428/413, 428/414, 361/748, 361/750, 361/751, 174/52.4, 437/209, 156/252, 156/344, 156/552, 156/249, 156/275.7, 156/295, 156/73.2
• US Class Current: 156/295
• CPC Class Codes: H01L 21/4828 Etching etching for cleaning without patterning H01L21/4835
• CPC Class Codes: H01L 21/4839 Assembly of a flat lead with an insulating support, e.g. for TAB
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 23/49572 consisting of thin flexible metallic tape with or without a film carrier H01L23/49503 - H01L23/49568 and H01L23/49575 - H01L23/49579 take precedence
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: Y10S 156/922 Specified electronic component delaminating in preparation for recycling
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1056 Perforating lamina
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 428/12903 Cu-base component
• CPC Class Codes: Y10T 428/1291 Next to Co-, Cu-, or Ni-base component
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31515 : As intermediate layer
• CPC Class Codes: Y10T 428/31678 : Of metal
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A TAB (tape automated bonding) tape of high precision is formed without the deformations of its conductor pattern and the like and which is hermetically sealed with resin. The method for producing a TAB tape includes punching required holes, such as a device hole 14 and the like, in a metal plate 10 coated with an insulating adhesive layer 12 over the area where a conductor pattern is to be formed; and forming a required conductor pattern 24 by bonding a conductor metal foil onto the adhesive layer and by etching the conductor metal foil. Thus, the material cost of this TAB tape can be reduced and the production of this tape is facilitated.

Claims

1. A process for producing a tape automated bonding tape, comprising the steps of:

forming a device hole, a window hole, or a sprocket hole in a metal plate over an area where a conductor metal foil is to be bonded;

placing an adhesive layer on the metal plate;

bonding a conductor metal foil onto the adhesive layer, wherein the conductor metal foil is the same metal as the metal plate;

coating the metal plate with a protective plating which is not corroded by an etchant which is to be used for etching the conductor metal foil; and

forming the required conductor pattern by etching the conductor metal foil with the etchant.

2. A process for producing a tape automated bonding tape according to claim 1, wherein copper is used as the material for both of the metal plate and the conductor metal foil.

3. A process for producing a tape automated bonding tape according to claim 1, wherein the insulating adhesive layer is epoxy resin adhesive or polyimide resin adhesive.

4. A process for producing a tape automated bonding tape according to claim 3, wherein copper is used as the material for both of the metal plate and the conductor metal foil.

5. A process for producing a tape automated bonding tape, said process comprising:

coating a metal plate with protective plating which is not corroded by an etchant which is to be used for etching of the conductor metal foil;

forming a device hole, a window hole, or a sprocket hole in the metal plate;

placing the adhesive layer on the metal plate over an area where the conductor metal foil is to be bonded;

bonding the conductor metal foil onto the adhesive layer; and

forming a required conductor pattern by etching the conductor metal foil with the etchant.

6. A process for producing a tape automated bonding tape according to claim 5, wherein after the adhesive layer is placed on the metal plate, the adhesive layer is formed with a corresponding device hole, a corresponding window hole, or a corresponding sprocket hole corresponding to the holes of the metal plate, in such a manner that the holes of the adhesive layer are smaller than those of the metal plate, so that an inside edge of the respective holes of the adhesive layer extend inward from an inside edge of the respective holes of the metal plate.

7. A process for producing a tape automated bonding tape according to claim 5, wherein the device hole, the window hole, or the sprocket hole are filled with protective resist, before the conductor pattern is formed by etching the conductor metal foil.

8. A process for producing a tape automated bonding tape according to claim 5, wherein copper is used as the material for both of the metal plate and the conductor metal foil.

9. A process for producing a tape automated bonding tape, said process comprising:

forming a device hole, a window hole, or a sprocket hole in a metal plate;

coating the metal plate with protective plating which is not corroded by an etchant;

placing the adhesive layer on the metal plate over an area where a conductor metal foil is to be bonded;

bonding the conductor metal foil onto the adhesive layer; and

forming a required conductor pattern by etching the conductor metal foil.

10. A process for producing a tape automated bonding tape according to claim 9, wherein after the adhesive layer is placed on the metal plate, the adhesive layer is formed with a device hole, a window hole, or a sprocket hole corresponding to the holes of the metal plate, in such a manner that the holes of the adhesive layer are smaller than those of the metal plate, so that inside edges of respective holes of the adhesive layer extend inward from inside edges of the respective holes of the metal plate.

11. A process for producing a tape automated bonding tape according to claim 9, wherein copper is used as the material for both of the metal plate and the conductor metal foil.