Method of manufacturing diamond heat sink

• US 6,007,730 A
• Filed: 02/10/1998
• Issued: 12/28/1999
• Est. Priority Date: 02/14/1997
• Status: Expired due to Fees

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Shiomi, Hiromu, Kumazawa, Yoshiaki
• Primary Examiner(s): KLEMANSKI, HELENE G
• Application Number:
  US09/021,546
• Time in Patent Office: 686 Days
• Field of Search: 216/17, 216/41, 216/51, 216/56, 216/65, 216/67, 216/81, 252/70, 438/105, 257/706, 257/712, 257/930
• US Class Current: 216/17
• CPC Class Codes: H01L 21/4871 Bases, plates or heatsinks
• CPC Class Codes: H01L 21/4878 Mechanical treatment, e.g. deforming
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 257/93 Thermoelectric, e.g. peltier effect cooling

Abstract

A diamond polycrystal body having metal films on its upper and lower surfaces is cut in the vertical direction using a laser to form a diamond polycrystal body piece having upper and lower surfaces and a cut surface connecting the upper and lower surfaces. The cut surface may be damaged and include graphite resulting from the laser cutting. To remove the damage and the graphite, the cut surface of the diamond polycrystal body piece is then plasma-treated. Thereby a prescribed degree of electrical insulation between the metallized upper and lower surfaces can be ensured.

Claims

1. A method of manufacturing a diamond heat sink, comprising the steps of:

preparing a diamond polycrystal body having metal films formed on upper and lower body surfaces thereof;

cutting said diamond polycrystal body, thereby forming at least one diamond polycrystal body piece having upper and lower piece surfaces with portions of said metal films thereon and a cut surface connecting said upper and lower piece surfaces; and

after said cutting is completed, plasma-treating said cut surface of said diamond polycrystal body piece with a plasma.

2. The method of manufacturing a diamond heat sink as recited in claim 1, wherein said cutting of said diamond polycrystal body is performed using a YAG laser or an excimer laser.

3. The method of manufacturing a diamond heat sink as recited in claim 1, wherein said plasma-treating comprises forming said plasma of a plasma material gas comprising oxygen, halogen, a halogen compound or an inert gas.

4. The method of manufacturing a diamond heat sink as recited in claim 1, further comprising masking a surface of said diamond polycrystal body piece other than said cut surface with a resin which is softer than said metal film, prior to carrying out said plasma-treating of said cut surface.

5. The method of manufacturing a diamond heat sink as recited in claim 1, further comprising arranging a metal mask to mask said upper and lower piece surfaces prior to said plasma-treating of said cut surface so that said plasma is prevented from coming into contact with said upper and lower piece surfaces of said diamond polycrystal body piece.

6. The method of manufacturing a diamond heat sink as recited in claim 1, comprising continuing said plasma-treating until an electrical resistance between said upper and lower piece surfaces becomes at least 1×

10⁶ Ω

.

7. The method of manufacturing a diamond heat sink as recited in claim 1, wherein said diamond polycrystal body has a thermal conductivity of at least 5 w/cmK.

8. The method of manufacturing a diamond heat sink as recited in claim 3, wherein said plasma material gas comprises said oxygen and said halogen compound, said halogen compound is CF₄, and a ratio CF₄ /O₂ is in the range from greater than 0% to 70%.

9. The method of manufacturing a diamond heat sink as recited in claim 8, wherein said ratio CF₄ /O₂ is in the range from 5% to 50%.

10. The method of manufacturing a diamond heat sink as recited in claim 3, wherein said plasma material gas consists essentially of said oxygen.

11. The method of manufacturing a diamond heat sink as recited in claim 1, further comprising, before said step of cutting, a step of patterning at least a first one of said metal films comprising applying a photoresist layer onto said first metal film, patterning said photoresist layer by photolithography, and then etching a pattern into said first metal film through said patterned photoresist layer by ion beam etching.

12. The method of manufacturing a diamond heat sink as recited in claim 1, wherein said plasma is an RF plasma, and wherein said plasma-treating comprises generating said RF plasma by applying RF power to a plasma material gas so as to ionize said gas and form said RF plasma, and exposing said cut surface to said RF plasma.

13. The method of manufacturing a diamond heat sink as recited in claim 12, wherein said generating of said RF plasma is carried out under a reduced pressure of not more than 50 mTorr.

14. The method of manufacturing a diamond heat sink as recited in claim 1, wherein said plasma-treating comprises a reactive ion etching of said cut surface using said plasma.

15. The method of manufacturing a diamond heat sink as recited in claim 1, further comprising, after said cutting and before said plasma-treating, an additional step of stacking a plurality of said at least one diamond polycrystal body piece respectively alternatingly with buffer members of polymer resin so that said cut surface of each said diamond polycrystal body piece is exposed and said portions of said metal films provided on said upper and lower piece surfaces of each said diamond polycrystal body piece are covered by said buffer members, and wherein said plasma-treating is carried out to contact said plasma onto said exposed cut surfaces.

16. The method of manufacturing a diamond heat sink as recited in claim 1, further comprising, after said cutting and before said plasma-treating, an additional step of arranging and fixing a plurality of said at least one diamond polycrystal body piece in respective receiving holes provided in a jig and then arranging a metal film mask having a plurality of slit openings over said jig so that said slit openings expose said cut surfaces of said diamond polycrystal body pieces and said jig covers said portions of said metal films provided on said upper and lower piece surfaces, and wherein said plasma-treating is carried out to contact said plasma onto said exposed cut surfaces.