Multilayered substrate and method for its production

• US 6,007,886 A
• Filed: 06/24/1998
• Issued: 12/28/1999
• Est. Priority Date: 06/27/1997
• Status: Expired due to Fees

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Takigami, Kotaro
• Primary Examiner(s): THOMAS, ALEXANDER S
• Application Number:
  US09/103,507
• Time in Patent Office: 552 Days
• Field of Search: 428/43, 428/136, 428/137, 428/172, 156/252, 156/268
• US Class Current: 428/43
• CPC Class Codes: B32B 2038/047 Perforating
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 3/10 characterised by a discontinuous layer, i.e. formed of separate pieces of material
• CPC Class Codes: B32B 3/266 characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/0004 Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2201/09827 Tapered, e.g. tapered hole, via or groove bevelled, chamferred or tapered edge H05K2201/09154
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10T 156/1056 Perforating lamina
• CPC Class Codes: Y10T 156/1057 Subsequent to assembly of laminae
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 428/15 Sheet, web, or layer weakened to permit separation through thickness
• CPC Class Codes: Y10T 428/24314 Slit or elongated
• CPC Class Codes: Y10T 428/24322 : Composite web or sheet
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet

Abstract

A multilayered substrate divisible into a plurality of parts at predetermined positions of division is configured such that intermittently formed perforation-like holes or slit-like holes are present at the positions of division of a core layer, while V-cut V-grooves are present at the positions of division of surface layers. The multilayered substrate divisible at predetermined positions of division is also configured such that first intermittently formed holes (perforation-like holes, slit-like holes, or widely spaced holes) are present at the positions of division of the core layer, while second intermittently formed holes (perforation-like holes, or slit-like holes) are present at the positions of division of the surface layers so as to pass through the multilayered substrate, and at the positions of division of the core layer, each of the second holes is located between the adjacent first holes, whereby the first holes and the second holes are continuous with each other. Methods for production of these multilayered substrates are also disclosed.

Claims

1. A multilayered substrate comprising surface layers laminated on a core layer and being divisible into a plurality of parts at predetermined positions of division, wherein

intermittently formed holes are present at the positions of division of the core layer, and cut grooves are present at the positions of division of the surface layers.

2. A method for production of a multilayered substrate comprising surface layers laminated on a core layer and being divisible into a plurality of parts at predetermined positions of division, said method comprising:

forming intermittent holes at the positions of division of the core layer;

laminating the surface layers on the core layer; and

cutting the surface layers at the positions of division to form grooves.