Directed energy assisted in vacuo micro embossing

• US 6,007,888 A
• Filed: 05/08/1998
• Issued: 12/28/1999
• Est. Priority Date: 05/08/1998
• Status: Expired due to Term

• Current Assignee: Milford B. Kime
• Original Assignee: Milford B. Kime
• Inventors: Kime, Milford B.
• Primary Examiner(s): MULVANEY, ELIZABETH EVANS
• Application Number:
  US09/075,155
• Time in Patent Office: 599 Days
• Field of Search: 264/1.1, 264/1.31, 264/1.33, 264/101, 264/107, 264/220, 428/64.1, 428/64.2, 428/64.4, 428/411.1, 428/913, 430/270.1, 430/495.1, 430/945, 369/275.1, 369/283, 369/288
• US Class Current: 428/64.1
• CPC Class Codes: B29C 2035/085 using gamma-ray
• CPC Class Codes: B29C 2035/0872 using ion-radiation, e.g. alpha-rays
• CPC Class Codes: B29C 2035/0877 using electron radiation, e.g. beta-rays
• CPC Class Codes: B29C 2791/006 Using vacuum
• CPC Class Codes: B29C 35/08 by wave energy or particle radiation B29C64/00, B29C71/04 take precedence
• CPC Class Codes: B29C 35/10 for articles of indefinite length
• CPC Class Codes: B29C 39/148 characterised by the shape of the surface
• CPC Class Codes: B29C 59/04 using rollers or endless belts
• CPC Class Codes: B29L 2017/00 Carriers for sound or information
• CPC Class Codes: G02B 5/1852 using mechanical means, e.g. ruling with diamond tool, moulding
• CPC Class Codes: G03F 7/0017 for the production of embossing, cutting or similar devices; for the production of casting means
• CPC Class Codes: G03H 1/028 by embossing
• CPC Class Codes: G03H 2001/043 Non planar recording surface, e.g. curved surface
• CPC Class Codes: G11B 7/26 Apparatus or processes specially adapted for the manufacture of record carriers
• CPC Class Codes: Y10S 428/913 Material designed to be responsive to temperature, light, moisture
• CPC Class Codes: Y10S 430/146 Laser beam
• CPC Class Codes: Y10T 428/21 Circular sheet or circular blank

Abstract

Various configurations of a directed energy assisted micro embossing machine/station in a vacuum chamber utilized in a continuous manufacturing process and the web structure products made by that process (optical disks, cards, tapes, holographic reflectors, diffusers, binary optical elements, etc.) are disclosed. The configurations can include a single machine roll to roll system for embossing optical features on the surface of a single substrate and applying appropriate metallic, dielectric, semiconductor, polymer and other coatings all in a vacuum chamber.

Claims

1. Optical media and optical element web structures comprising a micro embossing refractive or diffractive relief surface on a single substrate surface coated with optical functioning metal, semiconductor, dielectric, dye, polymer and other materials plus a mechanical protective layer, wherein said micro embossing and surface coating(s) are performed entirely in vacuum.

2. The optical media and optical element web structures as defined in claim 1 wherein said optical media and optical elements comprise optical memory disks, cards, tapes and holographic or binary diffractive elements on the same roll or sheet.

3. A continuous process for manufacturing optical storage media and/or optical elements from a continuous film substrate comprising the steps of:

evacuating the local environment,

within said local environment, embossing of the substrate, and

within said local environment, coating the embossed substrate.

4. The continuous process as defined in claim 3 wherein the step of embossing comprises the steps of:

forming read only memory media and forming holographic elements.

5. The continuous process as defined in claim 3 wherein the step of embossing comprises the steps of:

intimately contacting the substrate along a first portion of an embossing tool,

continuing the contacting of the substrate and the tool in a cross web linear fashion until the entire tool has impressed the substrate, and

conditioning that part of the substrate immediately prior to or at the contact point.

6. The process as defined in claim 5 wherein said conditioning comprises the step of a shallow depth dosing of the substrate by directing energy into the surface.

7. The process as defined in claim 6 wherein the step of directing energy includes directing a beam selected from the group consisting of electrons, ions, nuclear particles, photons, or any suitable part of the electromagnetic spectrum.

8. Apparatus for manufacturing optical storage media and optical elements from a continuous substrate comprising:

a vacuum chamber, and within said vacuum chamber,

means for embossing the substrate, and

means for coating the embossed substrate.

9. The apparatus as defined in claim 8 wherein said means for embossing comprises:

means for forming read only memory optical storage media, and

means for forming holographic or binary diffractive optical elements.

10. A continuous process for manufacturing optical storage media and/or optical elements from a continuous substrate comprising the steps of:

intimately contacting the substrate along a first portion of an embossing tool,

continuing the contacting of the substrate and the tool in a cross web linear fashion until the entire tool has impressed the substrate, and

conditioning that part of the substrate immediately prior to or at the contact point.

11. The process as defined in claim 10 further comprising to steps of placing the continuous process in a vacuum chamber, and subsequently coating the embossed surface in vacuo.

12. The process as defined in claim 11 wherein said conditioning comprises the step of a shallow depth dosing of the substrate by directing energy into the surface.

13. The process as defined in claim 12 further comprising the step of placing the directed energy source and embossing drum outside the vacuum chamber.

14. The process as defined in claim 12 wherein the step of directing energy includes directing a beam selected from the group consisting of electrons, ions, nuclear particles, photons, or any suitable part of the electromagnetic spectrum.

15. The process as defined in claim 10 wherein said conditioning comprises the step of a dosing of the embossing tool by directing energy into that part of the tool immediately prior to that part of the tool contacting the substrate.

16. The process as defined in claim 10 wherein the substrate surface is comprised of thermoformable polymer material and wherein the step of conditioning comprises the step of irradiating with a beam that causes the material to thermoform.

17. The process as defined in claim 10 wherein the substrate surface is comprised of monomer or co-polymer material and wherein the step of conditioning comprises the step of irradiating with a beam that causes the material to crosslink.

18. The process as defined in claim 10 wherein the substrate surface is comprised of thermoset resin material and wherein the step of conditioning comprises the step of irradiating with a beam that causes the material to thermoset.

19. The process as defined in claim 10 wherein the step of intimately contacting comprises the steps of:

attaching the embossing tool onto a first rotating drum, such that the embossing tool returns to a specific location,

directing the unwinding substrate into contact with a second rotating roll,

forcing the substrate against the first rotating drum substantially at the specific location with the nip between the roll and the drum, wherein said forcing causes the substrate to be impressed with the pattern on the embossing tool.

20. The process as defined in claim 10 further comprising the step of pre-heating the embossing tool to facilitate the embossing step of intimately contacting.

21. The process of claim 10 further comprising the steps of:

waiting until the embossed area has stabilized,

depositing a coating onto the embossed area, and

applying a polymer for sealing chemically and mechanically the coated embossed area.

22. The embossed substrate product produced by claims 3 or 4, or 5, or 6, or 7, or 10 through 21.