Packaged integrated circuit device

• US 6,008,541 A
• Filed: 04/15/1998
• Issued: 12/28/1999
• Est. Priority Date: 04/15/1997
• Status: Expired due to Term

• Current Assignee: Hyundai Electronics Industries Co. Ltd. (SK Hynix Inc.)
• Original Assignee: Hyundai Electronics Industries Co. Ltd. (SK Hynix Inc.)
• Inventors: Park, Sang Wook, Baig, Hyung Gil
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/060,140
• Time in Patent Office: 622 Days
• Field of Search: 257/773, 257/774, 257/775, 257/776, 257/692, 257/706, 257/707, 257/720, 257/625
• US Class Current: 257/773
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4826 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49517 Additional leads
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

Disclosed herein is a packaged integrated circuit device having symmetrical structure to minimize package warpage and to prevent the formation of voids. The packaged integrated circuit device includes an integrated circuit chip having pads in the form of the respective grooves on its both sides opposite to each other. Each pad groove in the integrated circuit chip is formed such that it penetrates vertically the integrated circuit chip. The surface of each pad groove is coated with solder. A plurality of inner lead structures each including an inner lead and a stopper are inserted into the pad grooves and are electrically connected with the pads. In each of the inner lead structures, solder is coated on a surface of portion being in contact with the pads. Each inner lead has a plate shape and is inserted vertically into the respective pad grooves. Each stopper has a plate shape and is formed in the respective inner leads such that it is laid horizontally upon the upper surface of the integrated circuit chip to prevent the inner lead from breaking away from the pads. In one embodiment, on a top end of the respective inner leads is placed the top portion of each of the outer leads to be electrically connected to the respective inner leads, and each of the stoppers is formed at middle height portion of the respective inner leads.

Claims

1. A packaged integrated circuit device comprising:

an integrated circuit chip having a plurality of pads in the form of grooves vertically penetrating opposite sides of the chip,;

a plurality of inner lead structures, each inner lead structure comprising an inner lead having a plate shaped vertically extending portion inserted into the grooves and a stopper formed on and penetrating the inner lead and disposed horizontally upon an upper surface of the chip to prevent the inner lead from breaking away from the chip; and

a mold encapsulating the chip and the inner lead structures.

2. The packaged integrated circuit device of claim 1, further comprising outer leads electrically connected to the inner leads and electrically connected to an exterior device.

3. The packaged integrated circuit device of claim 2, wherein each of the inner leads has a length longer than a length of each of the grooves, each of the stoppers is formed at the middle height portion of the respective inner leads, and each of the outer leads is connected to the top end of the respective inner leads.

4. The packaged integrated circuit device of claim 3, wherein each of the outer leads has a shape substantially of an elongated, offset Z, each outer lead having an upper horizontal portions connected to a top end of the respective inner leads.

5. The packaged integrated circuit device of claim 2, wherein each of the inner leads has a length which is the same as a length of each of the grooves, each of the stoppers is formed at a top end of the respective inner leads, and each of the outer leads is connected to an exposed side end of the respective inner leads.

6. The packaged integrated circuit device of claim 5, wherein each of the outer leads has a having a shape in which the vertical portion connected to the exposed side end of the respective inner leads.

7. The packaged integrated circuit device of claim 1, wherein each of the inner leads has a same size as each of the grooves, each of the stoppers is made of an electrically conductive material, and is formed at a top end of the respective inner leads, and is exposed to an exterior at an outer surface, thereby serving as an electrical contact electrically connecting the device to an exterior.

8. The packaged integrated circuit device of claim 1, wherein each of the stoppers has a portion protruded from a top end of the respective inner leads along a lengthwise direction of the respective inner leads, the protruded portion bent downwardly with an angle of 90 degrees and in contact with an outer surface of the mold.

9. The packaged integrated circuit device of claim 8, a wherein a length of each of the stoppers is the same as a length of the top end of the respective inner leads.

10. A packaged integrated circuit device comprising:

an integrated circuit chip having at least one groove formed on at least one side of the chip, the groove penetrating vertically into the chip;

a thermally conductive plate inserted vertically into the groove of the chip, and a stopper formed substantially normal to and connected with the plate and disposed horizontally upon an upper surface of the chip to prevent the plate from breaking away from the chip; and

a mold encapsulating at least the chip.

11. A packaged integrated circuit device comprising:

an integrated circuit chip having a plurality of pads in the form of grooves penetrating opposite sides of the chip;

a plurality of inner lead structures, each inner lead structure comprising an inner lead having a plate shaped extending portion inserted into the grooves and a stopper formed on and penetrating the inner lead and disposed upon an upper surface of the chip to prevent the inner lead from breaking away from the chip; and

a mold encapsulating the chip and the inner lead structures.

12. The packaged integrated circuit device of claim 11, further comprising outer leads electrically connected to the inner leads and electrically connected to an exterior device.

13. The packaged integrated circuit device of claim 12, wherein each of the inner leads has a length longer than a length of each of the grooves, each of the stoppers is formed at the middle height portion of the respective inner leads, and each of the outer leads is connected to the top end of the respective inner leads.

14. The packaged integrated circuit device of claim 13, wherein each of the outer leads has a shape substantially of an elongated, offset Z, each outer lead having an upper horizontal portions connected to a top end of the respective inner leads.

15. The packaged integrated circuit device of claim 14, wherein each of the inner leads has a length which is the same as a length of each of the grooves, each of the stoppers is formed at a top end of the respective inner leads, and each of the outer leads is connected to an exposed side end of the respective inner leads.

16. The packaged integrated circuit device of claim 15, wherein each of the outer leads has a shape having a vertical portion connected to the exposed side end of the respective inner leads.

17. The packaged integrated circuit device of claim 11, wherein each of the inner leads has a same size as each of the grooves, each of the stoppers is made of an electrically conductive material, and is formed at a top end of the respective inner leads, and is exposed to an exterior at an outer surface, thereby serving as an electrical contact electrically connecting the device to an exterior.

18. The packaged integrated circuit device of claim 11, wherein each of the stoppers has a portion protruded from a top end of the respective inner leads along a lengthwise direction of the respective inner leads, the protruded portion bent downwardly with an angle of 90 degrees and in contact with an outer surface of the mold.

19. The packaged integrated circuit device of claim 18, wherein a length of each of the stoppers is the same as a length of the top end of the respective inner leads.