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Implantable medical device having flat electrolytic capacitor with registered electrode layers

  • US 6,009,348 A
  • Filed: 06/24/1998
  • Issued: 12/28/1999
  • Est. Priority Date: 04/03/1998
  • Status: Expired due to Term
First Claim
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1. A method of making an hermetically sealed implantable medical device, comprising the steps of:

  • (a) providing a housing for the implantable medical device;

    (b) providing an energy source for the implantable medical device and disposing the energy source within the housing;

    (c) forming a substantially flat aluminum electrolytic capacitor, comprising the steps of;

    (i) providing at least one cathode layer formed of cathode foil and having a first perimeter, the at least one cathode layer having at least a first tab projecting from the first perimeter at a first predetermined perimeter location, the at least one cathode layer having top and bottom surfaces;

    (ii) providing a plurality of anode layers formed of aluminum anode foil, the plurality of anode layers forming at least a first anode sub-assembly having top and bottom surfaces, at least one of the plurality of anode layers being a first anode layer having a second perimeter and at least a second tab projecting from the second perimeter at a second predetermined perimeter location;

    (iii) providing at least a first separator layer formed of separator material;

    (iv) vertically stacking the at least one cathode layer, the plurality of anode layers and the first separator layer such that the first separator layer is disposed between the at least one cathode layer and the anode sub-assembly to form a capacitor electrode assembly;

    (v) aligning the first tab with a first predetermined registration position in the electrode assembly;

    (vi) aligning the second tab with a second predetermined registration position in the electrode assembly;

    (vii) placing the electrode assembly in a capacitor case having an open end;

    (viii) placing a cover over the open end of the case;

    (ix) joining the cover to the case;

    (d) disposing the capacitor in the housing;

    (e) connecting the capacitor to the power source, and(f) hermetically sealing the housing.

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