Method of making a printed circuit board having filled holes
First Claim
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1. A method of making a circuitized substrate, said method comprising:
- providing a layer of dielectric material having a first surface;
forming at least one hole within said layer of dielectric material;
positioning a quantity of uncured, dielectric fill material within said at least one hole and onto at least part of said first surface;
partially curing said quantity of uncured, dielectric fill material within said at least one hole;
removing said dielectric fill material on said at least part of said first surface; and
thereafter further curing said partially cured dielectric fill material within said at least one hole.
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Abstract
A method of making a circuitized substrate wherein fill material is forced into the substrate'"'"'s holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product'"'"'s circuit density. The fill is provided in a substantially uncured state, following which partial cure occurs. Thereafter, the fill is substantially fully cured and the aforementioned circuit elements may then be provided directly thereon. Alternatively, a dual fill process is used with both quantities of uncured fill being disposed in each hole and then cured by a singular UV exposure step.
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Citations
34 Claims
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1. A method of making a circuitized substrate, said method comprising:
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providing a layer of dielectric material having a first surface; forming at least one hole within said layer of dielectric material; positioning a quantity of uncured, dielectric fill material within said at least one hole and onto at least part of said first surface; partially curing said quantity of uncured, dielectric fill material within said at least one hole; removing said dielectric fill material on said at least part of said first surface; and thereafter further curing said partially cured dielectric fill material within said at least one hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of making a circuitized substrate, said method comprising:
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providing a layer of dielectric material having a first surface; forming at least one hole within said layer of dielectric material; positioning a first quantity of uncured, dielectric fill material within said at least one hole and onto at least part of said first surface; removing said uncured, dielectric fill material on said at least part of said first surface; positioning a second quantity of uncured, dielectric fill material onto said first surface and substantially over said at least one hole having said first quantity of uncured, dielectric fill material therein; and thereafter substantially curing said first quantity of uncured dielectric fill material within said at least one hole and said second quantity of dielectric fill material within and substantially over said at least one hole. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification