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Method of and device for planarizing a surface of a semiconductor wafer

  • US 6,010,828 A
  • Filed: 02/19/1998
  • Issued: 01/04/2000
  • Est. Priority Date: 02/19/1998
  • Status: Expired due to Fees
First Claim
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1. A method of planarizing a photosensitive layer located over an irregular surface of a semiconductor wafer, comprising:

  • passing radiation through a first medium and a second medium, said first medium interfaced with second medium;

    passing said radiation from said second medium into said photosensitive layer interfaced with said second medium to uniformly expose said photosensitive layer, said first and second mediums and said photosensitive layer having radiation absorption coefficients such that said radiation terminates substantially within a plane of said photosensitive layer; and

    etching said photosensitive material to said plane, whereby said photosensitive layer is substantially planarized at said plane.

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