Heat-generating element cooling device

• US 6,011,216 A
• Filed: 07/24/1996
• Issued: 01/04/2000
• Est. Priority Date: 08/06/1992
• Status: Expired due to Fees

• Current Assignee: PFU Limited (Fujitsu Limited)
• Original Assignee: PFU Limited (Fujitsu Limited)
• Inventors: Shimanuki, Tadayoshi, Kitahara, Takashi
• Primary Examiner(s): Kincaid, Kristine
• Assistant Examiner(s): Mayo, III, William H.
• Application Number:
  US08/685,689
• Time in Patent Office: 1,259 Days
• Field of Search: 174/16.3, 174/252, 361/703, 361/709, 361/719, 361/720, 361/695, 361/699, 165/80.3, 165/185
• US Class Current: 174/16.3
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 3/022 the means being wires or pins
• CPC Class Codes: F28F 3/048 in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20572 within cabinets for removing heat from sub-racks, e.g. plenum

Abstract

A cooling device mounts a fan unit above a heat sink. The heat sink is mounted on a heat-generating element or buried therein. The cooling device produces an effective air flow and achieves a uniform cooling action by having the heat sink formed in various shapes. The cooling fan is disposed away from the heat sink or to the side of the same and is used for effective cooling through an air conduit passage formed by pipes or a cover.

Claims

1. A heat generating element cooling device comprising:

a heat sink disposed on a top surface of a heat generating element and said heat sink having a base surface and a plurality of heat-radiating fins extending from said base surface; and

a heat pipe, for transporting and diffusing heat, extending along said base surface of said heat sink between adjacent fins,

a cooling fan unit affixed above the heat sink,

wherein the base surface is at least partially inclined so as to have an inclined surface which descends toward a center portion, said heat-radiating fins provided on said inclined surface and formed successively higher toward the center portion and said heat pipe disposed so as to extend along said inclined surface from peripheral portions to the center portion.

2. A heat-generating element cooling device as set forth in claim 1, wherein the base surface of the heat sink is formed in a conical or a pyramid shape and the heat pipe extends spirally from the center portion to the peripheral portions.

3. A heat-generating element cooling device as set forth in claim 1, wherein

the inclined surface of the base surface of the heat sink is formed from two inclined surfaces which intersect on a line including the center portion, and

the heat pipe includes one main pipe disposed along said line and a plurality of sub-pipes disposed along said two inclined surfaces from the peripheral portions toward the main pipe.

4. A heat-generating element cooling device as set forth in any one of claims 2 or 3, wherein the heat pipe is buried in the base surface of the heat sink.

5. A heat-generating element cooling device as set forth in claim 1, wherein said cooling fan directs air toward said heat-radiating fins.