Apparatus to minimize integrated circuit heatsink E.M.I. radiation

• US 6,011,299 A
• Filed: 07/24/1996
• Issued: 01/04/2000
• Est. Priority Date: 07/24/1996
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Digital Equipment Corporation (HP Inc.)
• Inventors: Brench, Colin E.
• Primary Examiner(s): Arroyo, Teresa M.
• Application Number:
  US08/686,633
• Time in Patent Office: 1,259 Days
• Field of Search: 257/712, 257/713, 257/722, 257/659, 257/660, 361/818, 174/35 GC, 174/35 R
• US Class Current: 257/660
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15156 Side view
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15322 : being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19106 : in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence

Abstract

A set of conductive plates are positioned adjacent to and in close proximity with a unidirectional heatsink on a high frequency integrated circuit. The set of plates is generally electrically attached to the same ground potential voltage supply as the integrated circuit and serves to damped unwanted radio frequency electromagnetic radiation normally emitted by heatsinks. The same arrangement of plates can also serve as an external electromagnetic interference shield apparatus for the integrated circuit. The plates may alternatively be comprised of a conductive mesh to allow air flow through the plates.

Claims

1. An apparatus for reducing EMI interference associated with an electronic device, comprises:

at least one electrically conductive structure comprising;

a heat sink in thermal communication with said electronic device, said heat sink having a bottom surface proximate to said electronic device, a top surface disposed opposite said bottom surface, and at least one side surface disposed between said top and bottom surfaces;

at least one separate electrically conductive plate, having at least one electrical contact for electrically coupling to a reference plane, with said at least one electrically conductive plate physically and electrically insulated from direct contact with said heat sink, and solely disposed proximate to at least one of said at least one side surface.

2. The apparatus of claim 1 wherein said electronic device further comprising an integrated circuit and wherein said electrically conductive structure is disposed adjacent to, but not in direct electrical contact with said integrated circuit.

3. The apparatus of claim 2 wherein said electronic device further comprising a printed circuit board and wherein said integrated circuit and said electrically conductive plate are electrically and physically connected to the printed circuit board.

4. The apparatus of claim 3 wherein said integrated circuit and said electrically conductive plate are electrically connected to a voltage reference plane disposed upon said printed circuit board.

5. The apparatus of claim 1 wherein said electrically conductive structure has said heat sink physically isolated and electrically insulated from said at least one electrically conductive plate by a corresponding one of at least one air gap therebetween.

6. The apparatus of claim 1 wherein said electrically conductive structure has said heat sink electrically isolated from said at least one electrically conductive plate by a corresponding one of at least one layer of electrically insulating material disposed therebetween.

7. The apparatus of claim 6 wherein said electrically insulating material is physically attached to at least one of said electrically conductive plate and said electrically isolated heat sink.

8. The apparatus of claim 1 wherein said electrically conductive structure is disposed to protect said electronic circuit from radiation.

9. The apparatus of claim 1 wherein further said at least one electrically conductive plate comprises two self supporting plates on opposite sides of said electronic device.

10. The apparatus of claim 1 wherein further said at least one electrically conductive plate comprises four plates disposed to form a loose quadrilateral like structure surrounding said heat sink.

11. The apparatus of claim 1 wherein further said at least one electrically conductive plate is comprised of a printed circuit board having at least one conductive layer electrically connected to said reference plane.

12. The apparatus of claim 1 wherein further said at least one electrically conductive plate comprises a conductive mesh with apertures in said conductive mesh of a selected maximum size electrically connected to said reference plane.

13. The apparatus of claim 1 wherein further said reference plane is a variable voltage source producing an opposing field partially canceling EMI from said electronic device.

14. The apparatus of claim 1 wherein said at least one electrically conductive plate is approximately the same height and width as said heat sink.

15. An apparatus to suppress radio frequency radiation from packaged integrated circuits, comprises;

a packaged integrated circuit disposed within an electronic circuit package, said package having a unidirectional heat sink attached thereto,

two planar conductive plates electrically isolated from while disposed in close proximity with said unidirectional heat sink, said conductive plates being aligned parallel to a predetermined direction of preferred air flow, with each one of said planar conductive plates having at least one electrical contact for connection to a voltage reference potential.