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Apparatus for attaching adhesive tape to lead-on-chip leadframes

  • US 6,012,502 A
  • Filed: 07/24/1997
  • Issued: 01/11/2000
  • Est. Priority Date: 07/31/1995
  • Status: Expired due to Term
First Claim
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1. An apparatus for attaching adhesive tape to a leadframe comprising:

  • a support frame;

    an adhesive tape at least partially contained on a reel rotatably mounted to the support frame;

    a pair of feed rollers attached to the support frame and configured to index the tape;

    a stationary cutter base mounted to the support frame comprising an opening therethrough having a peripheral outline and configured to receive a leading terminal end of the tape and a portion of the tape following the leading terminal end, a channel therein configured to guide the tape into the opening, and a block proximate the channel configured to hold the tape in the channel and in the opening; and

    a cutter configured to move through the opening to cut a decal from the tape within the opening and to apply the decal to the leadframe, the cutter and the decal having an outline substantially matching the peripheral outline of the opening.

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