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Solder bonding printed circuit boards

  • US 6,013,877 A
  • Filed: 03/12/1998
  • Issued: 01/11/2000
  • Est. Priority Date: 03/12/1998
  • Status: Expired due to Term
First Claim
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1. Method for the assembly of multiple interconnection substrates in which at least one of said multiple interconnection substrates is a double sided circuit board with plated through holes extending through said double sided circuit board, the method comprising applying a first solder material to at least one of said interconnection substrates and bonding said interconnection substrates together by melting said first solder material, the method characterized by the step of filling said through holes with a second solder material prior to the step of bonding said interconnection substrates together, said second solder material having a solidus point at least 20°

  • C. higher than a liquidus point of said first solder material, and melting said first solder material at a temperature lower than the solidus point of said second solder material.

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