Elevated pin diode active pixel sensor including a unique interconnection structure

• US 6,018,187 A
• Filed: 10/19/1998
• Issued: 01/25/2000
• Est. Priority Date: 10/19/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Sun, Xin, Perner, Frederick A., Theil, Jeremy A., Cao, Min, Ma, Shawming, Vook, Dietrich W., Ray, Gary W.
• Primary Examiner(s): Ngo , Ngan V.
• Application Number:
  US09/174,718
• Time in Patent Office: 463 Days
• Field of Search: 257/291, 257/292, 257/290, 257/444, 257/458, 257/656
• US Class Current: 257/458
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 31/02002 Arrangements for conducting electric current to or from the device in operations
• CPC Class Codes: Y02E 10/548 Amorphous silicon PV cells

Abstract

An active pixel sensor. The active pixel sensor includes a substrate, an interconnect structure adjacent to the substrate, and at least one photo sensor adjacent to the interconnect structure. Each photo sensor includes an individual pixel electrode. An I-layer is formed over all of the pixel electrodes. A transparent electrode is formed over the I-layer. An inner surface of the transparent electrode is electrically connected to the I-layer and the interconnect structure.

Claims

1. An active pixel sensor comprising:

a substrate;

an interconnect structure adjacent to the substrate;

at least one photo sensor adjacent to the interconnect structure, each photo sensor comprising an individual pixel electrode;

an I-layer formed over the at least one pixel electrode; and

a transparent electrode formed over the I-layer, an inner surface of the transparent electrode physically and electrically connected to the I-layer, and the inner surface of the transparent electrode electrically connected to the interconnect structure through a conductive via.

2. The active pixel sensor as recited in claim 1, wherein each pixel electrode comprise an N-layer.

3. The active pixel sensor as recited in claim 1, wherein the interconnection structure electrically interconnects the pixel electrodes to the substrate.

4. The photo diode active pixel sensor as recited in claim 1, wherein the I-layer and the pixel electrodes each comprise amorphous silicon.

5. The photo diode active pixel sensor as recited in claim 1, further comprising a P-layer formed between the I-layer and the transparent electrode, the inner surface of the transparent electrode electrically connected to the P-layer, the I-layer, and the interconnect structure.

6. The photo diode active pixel sensor as recited in claim 5, wherein the P-layer comprises amorphous silicon.

7. The photo diode active pixel sensor as recited in claim 1, wherein the inner surface of the transparent electrode is electrically connected to the interconnect structure through a tungsten plug.

8. The photo diode active pixel sensor as recited in claim 1, wherein the transparent electrode comprises indium tin oxide.

9. The photo diode active pixel sensor as recited in claim 1, wherein the substrate comprises CMOS.

10. The photo diode active pixel sensor as recited in claim 1, wherein the substrate comprises active circuits which sense charge accumulated by the photo sensors due to the photo sensors receiving light.

11. The photo diode active pixel sensor as recited in claim 1, wherein the substrate comprises charge coupled devices.

12. The photo diode active pixel sensor as recited in claim 1, wherein the inner surface of the transparent electrode is electrically connected to the interconnect structure through a plurality of tungsten plugs.

13. The active pixel sensor as recited in claim 1, wherein each pixel electrode comprise a P-layer.

14. The active pixel sensor as recited in claim 1, wherein each pixel electrode comprise an conductive metal.

15. The photo diode active pixel sensor as recited in claim 14, further comprising a transparent silicide formed between the I-layer and the transparent electrode, the inner surface of the transparent electrode electrically connected to the transparent silicide, the I-layer, and the interconnect structure.